Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 292 maximum user I/Os, 3096 Kbit RAM bits, and 264 integrated 18x18 multipliers. Includes 8 transceiver blocks operating at 3.2 Gbps, 132 dedicated DSP slices, and 1 PCI block. Packaged in a 484-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, suitable for surface mounting and operating across a -40°C to 100°C temperature range.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-4CSG484I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.35(Max) |
| Seated Plane Height (mm) | 1.8(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 292 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 132 |
| PCI Blocks | 1 |
| Speed Grade | 4 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX75T-4CSG484I Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-4CSG484I to view detailed technical specifications.
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