High-performance Field Programmable Gate Array (FPGA) featuring 74,637 logic cells and 93,296 registers. This device offers 3096 Kbit of RAM, 264 integrated 18x18 multipliers, and 132 dedicated DSP blocks. It includes 8 transceiver blocks operating at up to 3.2 Gbps and a PCI block. The FPGA is built on 45nm process technology, operates at 1.2V, and is housed in a 900-pin, 31mm x 31mm Fine Pitch Ball Grid Array (FBGA) package for surface mounting.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-4FG900C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 900 |
| PCB | 900 |
| Package Length (mm) | 31 |
| Package Width (mm) | 31 |
| Package Height (mm) | 1.75 |
| Seated Plane Height (mm) | 2.25 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034 |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 576 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 132 |
| PCI Blocks | 1 |
| Speed Grade | 4 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX75T-4FG900C Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-4FG900C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.