Field Programmable Gate Array (FPGA) with 9152 logic cells and 11440 registers, built on 45nm process technology. Features 576 Kbit RAM, 32 multipliers (18x18), and 16 dedicated DSP blocks. Offers 338 maximum user I/Os and 6 DLLs/PLLs. This surface mount device is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package measuring 23x23x1.7mm with a 1mm pin pitch. Operates within a 0°C to 85°C temperature range.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX9-3FGG484C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 1.7 |
| Seated Plane Height (mm) | 2.2 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 338 |
| Number of Registers | 11440 |
| RAM Bits | 576Kbit |
| Device Logic Cells | 9152 |
| Process Technology | 45nm |
| Number of Multipliers | 32 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 16 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 32 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX9-3FGG484C Datasheet
Download the complete datasheet for Xilinx XC6SLX9-3FGG484C to view detailed technical specifications.
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