Field Programmable Gate Array (FPGA) with 9152 logic cells and 45nm process technology. Features 576 user I/Os, 11440 registers, and 576 Kbit RAM. Includes 32 multipliers (18x18) and 16 dedicated DSP slices. Operates with a transceiver speed of 3.2 Gbps and a 1.2V supply. Packaged in a 900-pin FBGA (Fine Pitch Ball Grid Array) with a 31mm x 31mm footprint and 1mm pin pitch, suitable for surface mounting. Extended operating temperature range from -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX9-3FGG900I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
900
PCB
900
Package Length (mm)
31
Package Width (mm)
31
Package Height (mm)
1.75
Seated Plane Height (mm)
2.25
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
576
Number of Registers
11440
RAM Bits
576Kbit
Device Logic Cells
9152
Process Technology
45nm
Number of Multipliers
32 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
16
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX9-3FGG900I Datasheet
Download the complete datasheet for Xilinx XC6SLX9-3FGG900I to view detailed technical specifications.
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