Field Programmable Gate Array (FPGA) with 9152 logic cells and 186 maximum user I/Os. Features 11440 registers, 576 Kbit RAM, 32 (18x18) multipliers, and 16 dedicated DSP blocks. Operates on 45nm technology with a transceiver speed of 3.2 Gbps. Housed in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) package measuring 17x17x1mm, suitable for surface mounting. Includes 32 Block RAMs and 6 DLLs/PLLs, with an operating temperature range of 0°C to 85°C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX9-L1FT256C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
186
Number of Registers
11440
RAM Bits
576Kbit
Device Logic Cells
9152
Process Technology
45nm
Number of Multipliers
32 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
16
Speed Grade
1L
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX9-L1FT256C Datasheet
Download the complete datasheet for Xilinx XC6SLX9-L1FT256C to view detailed technical specifications.
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