Field Programmable Gate Array (FPGA) with 199,680 logic cells and 249,600 registers, built on 40nm process technology. Features 12,384 Kbit RAM bits, 640 dedicated DSP slices, and 640 multipliers (25x18). Includes 16 transceiver blocks operating at up to 3.75 Gbps, 2 PCI blocks, and 1 Ethernet MAC. Packaged in a 1156-pin Flip Chip Ball Grid Array (FCBGA) with a 35mm x 35mm footprint, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX195T-2FF1156C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1156 |
| PCB | 1156 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 2.9(Max) |
| Seated Plane Height (mm) | 3.5(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Virtex®-6 CXT |
| Maximum Number of User I/Os | 600 |
| Number of Registers | 249600 |
| RAM Bits | 12384Kbit |
| Device Logic Cells | 199680 |
| Process Technology | 40nm |
| Ethernet MACs | 1 |
| Number of Multipliers | 640 (25x18) |
| Programmability | Yes |
| Transceiver Blocks | 16 |
| Transceiver Speed | 3.75Gbps |
| Program Memory Type | Flash |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 640 |
| PCI Blocks | 2 |
| Speed Grade | 2 |
| Total Number of Block RAM | 344 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6VCX195T-2FF1156C Datasheet
Download the complete datasheet for Xilinx XC6VCX195T-2FF1156C to view detailed technical specifications.
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