Field Programmable Gate Array (FPGA) with 199,680 logic cells and 249,600 registers, built on 40nm process technology. Features 12,384 Kbit RAM, 640 dedicated DSP multipliers (25x18), and 344 block RAMs. Includes 16 transceiver blocks operating at 3.75 Gbps, 2 PCI blocks, and 1 Ethernet MAC. Packaged in a 784-pin FCBGA (29mm x 29mm x 2.5mm Max) for surface mounting, with a maximum of 400 user I/Os and an operating temperature range of -40°C to 100°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX195T-2FF784I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
784
PCB
784
Package Length (mm)
29
Package Width (mm)
29
Package Height (mm)
2.5(Max)
Seated Plane Height (mm)
3.1(Max)
Package Material
Plastic
Mounting
Surface Mount
Family Name
Virtex®-6 CXT
Maximum Number of User I/Os
400
Number of Registers
249600
RAM Bits
12384Kbit
Device Logic Cells
199680
Process Technology
40nm
Ethernet MACs
1
Number of Multipliers
640 (25x18)
Programmability
Yes
Transceiver Blocks
16
Transceiver Speed
3.75Gbps
Program Memory Type
Flash
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
640
PCI Blocks
2
Speed Grade
2
Total Number of Block RAM
344
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6VCX195T-2FF784I Datasheet
Download the complete datasheet for Xilinx XC6VCX195T-2FF784I to view detailed technical specifications.
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