Field-Programmable Gate Array (FPGA) featuring 199,680 logic cells and 249,600 registers, built on 40nm process technology. This device offers 12,384 Kbit of RAM, 640 dedicated DSP slices, and 344 block RAMs. It includes 16 transceiver blocks operating at up to 3.75 Gbps, one Ethernet MAC, and two PCI blocks. The 784-pin FCBGA package, measuring 29mm x 29mm with a 1mm pin pitch, supports surface mounting. Operating temperature range is -40°C to 100°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX195T-2FFG784I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 784 |
| PCB | 784 |
| Package Length (mm) | 29 |
| Package Width (mm) | 29 |
| Package Height (mm) | 2.5(Max) |
| Seated Plane Height (mm) | 3.1(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Virtex®-6 CXT |
| Maximum Number of User I/Os | 400 |
| Number of Registers | 249600 |
| RAM Bits | 12384Kbit |
| Device Logic Cells | 199680 |
| Process Technology | 40nm |
| Ethernet MACs | 1 |
| Number of Multipliers | 640 (25x18) |
| Programmability | Yes |
| Transceiver Blocks | 16 |
| Transceiver Speed | 3.75Gbps |
| Program Memory Type | Flash |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 640 |
| PCI Blocks | 2 |
| Speed Grade | 2 |
| Total Number of Block RAM | 344 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6VCX195T-2FFG784I Datasheet
Download the complete datasheet for Xilinx XC6VCX195T-2FFG784I to view detailed technical specifications.
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