Field Programmable Gate Array (FPGA) with 241,152 logic cells and 301,440 registers. Features 14,976 Kbit RAM bits, 768 dedicated DSP multipliers (25x18), and 416 block RAMs. This 40nm technology device offers 600 user I/Os, 16 transceiver blocks operating at 3.75 Gbps, and 2 PCI blocks. Packaged in a 1156-pin Flip Chip Ball Grid Array (FCBGA) measuring 35x35mm, it supports surface mount installation and operates from 0°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX240T-1FF1156C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1156 |
| PCB | 1156 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 2.9(Max) |
| Seated Plane Height (mm) | 3.5(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Virtex®-6 CXT |
| Maximum Number of User I/Os | 600 |
| Number of Registers | 301440 |
| RAM Bits | 14976Kbit |
| Device Logic Cells | 241152 |
| Process Technology | 40nm |
| Ethernet MACs | 1 |
| Number of Multipliers | 768 (25x18) |
| Programmability | Yes |
| Transceiver Blocks | 16 |
| Transceiver Speed | 3.75Gbps |
| Program Memory Type | Flash |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 768 |
| PCI Blocks | 2 |
| Speed Grade | 1 |
| Total Number of Block RAM | 416 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6VCX240T-1FF1156C Datasheet
Download the complete datasheet for Xilinx XC6VCX240T-1FF1156C to view detailed technical specifications.
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