Field Programmable Gate Array (FPGA) with 241152 logic cells and 301440 registers, built on 40nm process technology. Features 14976 Kbit RAM, 768 multipliers (25x18), and 16 transceiver blocks operating at 3.75 Gbps. This 1156-pin FCBGA package, measuring 35x35mm with a 1mm pin pitch, supports surface mounting and offers 600 user I/Os. Includes 1 Ethernet MAC, 2 PCI blocks, and 416 block RAMs, with a speed grade of 2 and an operating temperature range of 0°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX240T-2FF1156C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
1156
PCB
1156
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
2.9(Max)
Seated Plane Height (mm)
3.5(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
Virtex®-6 CXT
Maximum Number of User I/Os
600
Number of Registers
301440
RAM Bits
14976Kbit
Device Logic Cells
241152
Process Technology
40nm
Ethernet MACs
1
Number of Multipliers
768 (25x18)
Programmability
Yes
Transceiver Blocks
16
Transceiver Speed
3.75Gbps
Program Memory Type
Flash
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
768
PCI Blocks
2
Speed Grade
2
Total Number of Block RAM
416
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6VCX240T-2FF1156C Datasheet
Download the complete datasheet for Xilinx XC6VCX240T-2FF1156C to view detailed technical specifications.
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