Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology. Features 5,616 Kbit RAM, 288 multipliers, and 156 Block RAMs. Offers 240 user I/Os, 12 transceiver blocks operating at 3.75 Gbps, and 1 Ethernet MAC. Packaged in a 484-pin FCBGA (Flip Chip Ball Grid Array) with dimensions of 23mm x 23mm, suitable for surface mounting. Operates across a temperature range of -40°C to 100°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX75T-1FF484I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 2.4(Max) |
| Seated Plane Height (mm) | 3(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Virtex®-6 CXT |
| Maximum Number of User I/Os | 240 |
| Number of Registers | 93120 |
| RAM Bits | 5616Kbit |
| Device Logic Cells | 74496 |
| Process Technology | 40nm |
| Ethernet MACs | 1 |
| Number of Multipliers | 288 (25x18) |
| Programmability | Yes |
| Transceiver Blocks | 12 |
| Transceiver Speed | 3.75Gbps |
| Program Memory Type | Flash |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 288 |
| PCI Blocks | 1 |
| Speed Grade | 1 |
| Total Number of Block RAM | 156 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6VCX75T-1FF484I Datasheet
Download the complete datasheet for Xilinx XC6VCX75T-1FF484I to view detailed technical specifications.
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