Field Programmable Gate Array (FPGA) with 125,000 logic cells and 157,200 registers, built on 28nm process technology. This device features 1060 Kbit RAM, 400 dedicated DSP slices, and 400 18x25 multipliers. It offers 128 maximum user I/Os and includes 2 Ethernet MACs. Packaged in a 676-pin Lidless FCBGA (27x27mm) for surface mounting, it operates within a 0°C to 85°C temperature range.
PackageLidless FCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC7Z030-1FBG676C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | Lidless FCBGA |
| Package/Case | Lidless FCBGA |
| Package Description | Flip Chip Lidless Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.84 |
| Seated Plane Height (mm) | 2.34 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Kintex-7 |
| Maximum Number of User I/Os | 128 |
| Number of Registers | 157200 |
| RAM Bits | 1060Kbit |
| Device Logic Cells | 125000 |
| Process Technology | 28nm |
| Ethernet MACs | 2 |
| Number of Multipliers | 400 (18x25) |
| Programmability | Yes |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 400 |
| Speed Grade | 1 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
| Device Number of DLLs/PLLs | 5 |
| Total Number of Block RAM | 265 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC7Z030-1FBG676C Datasheet
Download the complete datasheet for Xilinx XC7Z030-1FBG676C to view detailed technical specifications.
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