Lidless FCBGA Flip Chip Ball Grid Array FPGA with 676 pins, 27mm x 27mm x 1.84mm dimensions and 1mm pin pitch. Features 125,000 logic cells, 157,200 registers, 1060 Kbit RAM, and 400 dedicated DSP slices. Supports 128 user I/Os, 2 Ethernet MACs, and 400 multipliers (18x25). Operates across a -40°C to 100°C temperature range.
PackageLidless FCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC7Z030-2FBG676I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
Lidless FCBGA
Package/Case
Lidless FCBGA
Package Description
Flip Chip Lidless Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.84
Seated Plane Height (mm)
2.34
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
Kintex-7
Maximum Number of User I/Os
128
Number of Registers
157200
RAM Bits
1060Kbit
Device Logic Cells
125000
Process Technology
28nm
Ethernet MACs
2
Number of Multipliers
400 (18x25)
Programmability
Yes
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
400
Speed Grade
2
Differential I/O Standards Supported
LVDS|SSTL|HSTL
Device Number of DLLs/PLLs
5
Total Number of Block RAM
265
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC7Z030-2FBG676I Datasheet
Download the complete datasheet for Xilinx XC7Z030-2FBG676I to view detailed technical specifications.
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