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Technical Specifications
Xilinx XCV812E-6BG560C technical specifications.
General
| Package/Case | BGA |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Mount | Surface Mount |
| Number of Gates | 254016 |
| Number of I/Os | 404 |
| Number of Logic Blocks (LABs) | 4704 |
| Number of Logic Elements/Cells | 21168 |
| Operating Supply Voltage | 1.8V |
| Package Quantity | 1 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 1146880b |
| RoHS Compliant | No |
| Series | Virtex®-E EM |
| Speed Grade | 6 |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Xilinx XCV812E-6BG560C Datasheet
Download the complete datasheet for Xilinx XCV812E-6BG560C to view detailed technical specifications.
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