ABL Heatsinks
BGA-FC-015
ABL HEATSINKS BGA-FC-015 Heat Sink, For Ball Grid Array, Flip-Chip, BGA, 11 C/W, 24 mm, 40 mm, 40 mm
PackageBGA
MountingAdhesive
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Technical Specifications
ABL Heatsinks BGA-FC-015 technical specifications.
General
Package/Case
BGA
Color
Black
Height
24mm
Length
40mm
Mount
Adhesive
Natural Thermal Resistance
11°C/W
Reach SVHC Compliant
No
Width
40mm
Compliance
RoHS
Compliant
Datasheet
ABL Heatsinks BGA-FC-015 Datasheet
Download the complete datasheet for ABL Heatsinks BGA-FC-015 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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