
Passive BGA heat sink featuring a square, finned shape with a clip mount for efficient thermal management. Constructed from aluminum with a black anodized finish, this component offers a thermal resistance of 5.1°C/W at 100 LFM forced air flow. Designed for BGA packages, it measures 23mm in depth, 17.5mm in height, and 23mm in width.
Advanced Thermal Solutions ATS-50230P-C1-R0 technical specifications.
Download the complete datasheet for Advanced Thermal Solutions ATS-50230P-C1-R0 to view detailed technical specifications.
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