The maxiFLOW BGA Adhesive Heat Sink is a passive thermal management component with a package type of BGA and a material of aluminium. It has a thermal resistance of 2.8°C/W at 100 LFM forced air flow and is available in a package quantity of 100. The heat sink is packaged in bulk and is not radiation hardened. It is not RoHS compliant.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Advanced Thermal Solutions ATS-52375G-C1-R0 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Package/Case | BGA |
| Color | Blue |
| Depth | 37.5mm |
| Height | 12.5mm |
| Height Off Base | 0.492inch |
| Length | 37.5mm |
| Material | Aluminium |
| Mount | Adhesive |
| Package Cooled | BGA |
| Package Quantity | 100 |
| Packaging | Bulk |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Series | maxiFLOW |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 2.8°C/W |
| Type | Passive |
| Width | 1.476inch |
| RoHS | Not CompliantNo |
Download the complete datasheet for Advanced Thermal Solutions ATS-52375G-C1-R0 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
