
The maxiGRIP BGA heat sink is a passive thermal management component with a thermal resistance of 11.1°C/W at 100 LFM forced air flow. It features a BGA package, is made of anodized aluminium, and has a square shape with fins. The heat sink is available in bulk packaging with 100 units per package and is not radiation hardened or RoHS compliant.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Advanced Thermal Solutions ATS-53210K-C1-R0 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Package/Case | BGA |
| Color | Black |
| Depth | 21mm |
| Finish | Anodized |
| Height | 14.5mm |
| Height Off Base | 0.571inch |
| Length | 21mm |
| Material | Aluminium |
| Mount | Clip |
| Package Cooled | BGA |
| Package Quantity | 100 |
| Packaging | Bulk |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Series | maxiGRIP |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 11.1°C/W |
| Type | Passive |
| Width | 0.827inch |
| RoHS | Not CompliantNo |
Download the complete datasheet for Advanced Thermal Solutions ATS-53210K-C1-R0 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
