The M55302/58-D66X is a 66-contact RCP wire to board header with a 2-row configuration and 1.27mm terminal pitch. It features a straight body orientation and is designed for through-hole mounting. The header has a maximum current rating of 5A and operates within a temperature range of -65 to 125°C. It is suitable for use in applications where wire wrap termination is required.
MountingThrough Hole
Quick Jump:
Technical Specifications
Airborn M55302/58-D66X technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 66 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Wire Wrap |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/58-D66X Datasheet
Download the complete datasheet for Airborn M55302/58-D66X to view detailed technical specifications.
No datasheet is available for this part.