Airborn
M55302/58LD30Y-60
30-Contact RCP Wire-to-Board Header, 1.27mm Pitch, 2 Rows, Through Hole Mount
The M55302/58LD30Y-60 is a 30-contact RCP wire-to-board header from Airborn, designed for use in applications where a secure connection is required. It features a terminal pitch of 1.27mm and a body orientation of straight. The header is rated for a maximum operating temperature of 125°C and a minimum operating temperature of -65°C. It is suitable for through-hole mounting and has a height of 11.81mm. The M55302/58LD30Y-60 is a reliable and durable solution for connecting wires to printed circuit boards.
MountingThrough Hole
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Technical Specifications
Airborn M55302/58LD30Y-60 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 30 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Wire Wrap |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/58LD30Y-60 Datasheet
Download the complete datasheet for Airborn M55302/58LD30Y-60 to view detailed technical specifications.
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