The M55302/58LE14Y-19 is a 14-contact RCP wire-to-board header with a terminal pitch of 1.27mm. It features two rows of contacts and is designed for solder termination. The header has a straight body orientation and is rated for a maximum current of 5A. It has a height of 11.81mm and is suitable for through-hole mounting. The operating temperature range is from -65°C to 125°C.
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Airborn M55302/58LE14Y-19 technical specifications.
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 14 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
| RoHS Version | 2002/95/EC |
