The M55302/58LE14Y-63 is a 14-contact RCP wire-to-board header with a terminal pitch of 1.27mm and a body orientation of straight. It features a termination method of solder and can operate between -65°C and 125°C. This header is designed for through hole mounting and has a maximum current rating of 5A.
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Airborn M55302/58LE14Y-63 technical specifications.
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 14 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
| RoHS Version | 2002/95/EC |
