The M55302/64-B10F is a 10-contact RCP wire-to-board header from Airborn, designed for use in board-to-board and mezzanine applications. It features a 2-row configuration with a terminal pitch of 1.27mm and a termination method of solder. The header is rated for operation between -65°C and 125°C and has a maximum current rating of 5A. It is available in a through-hole package type, suitable for mounting in a variety of applications.
Airborn M55302/64-B10F technical specifications.
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 10 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Max Voltage Rating | 333V |
| Height | 11.81mm |
| RoHS Version | 2002/95/EC |
No datasheet is available for this part.
