Conn Board to Board RCP 240 POS 1.27mm Solder ST SMD T/R
Amphenol 55755-191LF technical specifications.
| Contact Material | Copper Alloy |
| Contact Plating | Gold, GXT, Copper, Tin, Silver |
| Length | 42.3mm |
| Mated Stacking Heights | 6mm |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of Positions | 240 |
| Number of Rows | 8 |
| Orientation | Straight |
| Packaging | Tape and Reel |
| Pitch | 0.05inch |
| RoHS Compliant | Yes |
| Series | MEG-Array®, MezzSelect™ |
| Termination | Solder |
| RoHS | Compliant |
No datasheet is available for this part.