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Technical Specifications
Amphenol FA1-NESP-PCB-1 technical specifications.
General
| Body Material | ZINC DIE CAST, Brass |
| Body Plating | Gold |
| Package/Case | SMB |
| Center Contact Plating | Gold |
| Contact Material | Brass |
| Contact Plating | Gold |
| Dielectric Material | PTFE |
| Housing Color | Green |
| Impedance | 50R |
| Insertion Loss | 0.3dB |
| Insulation Material | Teflon |
| Lead Free | Lead Free |
| Mating Cycles | 100 |
| Max Frequency | 4GHz |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -65°C |
| Mount | Surface Mount, Edge, Board |
| Number of Ports | 1 |
| Orientation | Straight |
| Polarity | Standard |
| RoHS Compliant | No |
| Termination | Solder |
Compliance
| RoHS | Not Compliant |
Datasheet
Amphenol FA1-NESP-PCB-1 Datasheet
Download the complete datasheet for Amphenol FA1-NESP-PCB-1 to view detailed technical specifications.
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