20-position SOIC to DIP adapter socket featuring gold-plated contacts for enhanced conductivity. Constructed with a durable glass and epoxy material, this component offers high-temperature operation and a lead-free design. Its SOIC package converts to a DIP footprint with a 1.58mm height and 25.4mm length, utilizing solder termination. This RoHS compliant electronic component is ideal for general interconnect applications.
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| Package/Case | SOIC |
| Contact Plating | Gold |
| Features | High Temperature |
| Height | 1.58mm |
| Lead Free | Lead Free |
| Length | 25.4mm |
| Material | Glass, Epoxy |
| Number of Contacts | 20 |
| Number of Positions | 20 |
| Package Quantity | 19 |
| RoHS Compliant | Yes |
| Series | Correct-A-Chip® 350000 |
| Termination | Solder |
| RoHS | Compliant |
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