PackageTSSOP
MountingSurface Mount
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Technical Specifications
Arizona Microtek AZ100EL11TR2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
3.1(Max)
Package Width (mm)
3.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Type
Fanout Buffer
Number of Outputs per Chip
2
Min Operating Supply Voltage
-4.2|4.2V
Max Operating Supply Voltage
-5.5|5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1JTT9
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Arizona Microtek AZ100EL11TR2 Datasheet
Download the complete datasheet for Arizona Microtek AZ100EL11TR2 to view detailed technical specifications.
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