PackageSOIC
MountingSurface Mount
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Technical Specifications
Arizona Microtek AZ10EL11DR2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
5(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AA
Type
Fanout Buffer
Number of Outputs per Chip
2
Min Operating Supply Voltage
-4.75|4.75V
Max Operating Supply Voltage
-5.5|5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1JTT9
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Arizona Microtek AZ10EL11DR2 Datasheet
Download the complete datasheet for Arizona Microtek AZ10EL11DR2 to view detailed technical specifications.
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