Gap Pad 3004 is a highly conformable and high-performance thermal interface material designed for applications requiring high thermal performance with a low modulus. It provides excellent cooling for electronic devices by effectively filling air gaps between heat-generating components and heat sinks or chassis.
Bergquist 2166063 technical specifications.
| Thermal Conductivity | 3.0W/m-K |
| Color | Grey |
| Thickness | 1.0mm |
| Hardness | 35Shore 00 |
| Operating Temperature Range | -60 to 200°C |
| RoHS | Compliant |
| Flammability Rating | UL 94 V-0 |
No datasheet is available for this part.
