The Bergquist Gap Pad TGP HC5000 (S-Class) is a high-performance, thermally conductive gap filling material with a thermal conductivity of 5.0 W/m-K. It is a silicone-based, highly conformable material designed to maintain structural integrity while applying minimal stress to fragile components. The material features natural inherent tack on one side to reduce interfacial thermal resistance and is reinforced with fiberglass for enhanced puncture, shear, and tear resistance.
Bergquist GPHC5.0-0.040-02-0816 technical specifications.
| Thermal Conductivity | 5.0W/m-K |
| Thickness | 0.040inches |
| Dimensions | 8 x 16inches |
| Hardness | 15Shore 00 |
| Continuous Use Temperature | -60 to 200°C |
| Dielectric Breakdown Voltage | >5000V |
| Reinforcement | Fiberglass |
| RoHS | Compliant |
| Halogen Free | Yes |
No datasheet is available for this part.
