The Bergquist Gap Pad HC 5.0 (High Compliance) is a thermally conductive, high-performance gap filling material reinforced with fiberglass. It features a thermal conductivity of 5.0 W/m-K and is designed for applications requiring low stress on sensitive components. The material is tacky on both sides to aid in assembly and provides high-compliance buffering for uneven surfaces or air gaps.
Bergquist GPHC5.0-0.060-02-0816 technical specifications.
| Thermal Conductivity | 5.0W/m-K |
| Thickness | 1.524mm |
| Dimensions | 406.40 x 203.20mm |
| Color | Gray |
| Reinforcement Carrier | Fiberglass |
| Storage Temperature | 25°C |
| Adhesive Type | Tacky - Both Sides |
| RoHS | ROHS3 Compliant |
| REACH | REACH Unaffected |
No datasheet is available for this part.
