GPHC5.0-0.100-02-0816

The Bergquist Gap Pad HC 5.0 (also known as TGP HC5000) is a high-conductivity, highly conformable gap filling material. This silicone-based thermal interface material offers a thermal conductivity of 5.0 W/m-K and is reinforced with fiberglass for superior shear and tear resistance. It is designed with a low-modulus resin formulation that allows for excellent wet-out characteristics even on rough topographies, ensuring maximum thermal performance with minimal stress on fragile components during assembly. The material is naturally tacky on both sides to eliminate the need for additional adhesive layers.