The Au1550 is a System on Chip (SoC) packaged in a 483-pin Ball Grid Array (BGA) with a plastic package material. It is designed for surface mount applications. The operating temperature range is not specified in the provided data.
PackageBGA
MountingSurface Mount
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Technical Specifications
Broadcom Au1550 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 483 |
| PCB | 483 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 50434 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
Datasheet
Broadcom Au1550 Datasheet
Download the complete datasheet for Broadcom Au1550 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.