This silicon N-channel enhanced VDMOS power MOSFET is rated for 45 V drain-to-source voltage and 18 A continuous drain current in an SOP-8 package. It uses high-density trench technology to reduce conduction loss and improve switching performance, with typical on-resistance of 5.2 mΩ at 10 V gate drive and 8.0 mΩ at 4.5 V. The device has 24 nC typical total gate charge, 1156 pF typical input capacitance, and a 3.1 W power dissipation rating at 25 °C ambient. It is intended for adaptor and charger power switching and synchronous rectification in DC/DC converters, and the package is stated to accord with RoHS requirements.
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China Resource Microelectronics HGE055NE4A technical specifications.
| Transistor Type | Silicon N-Channel Power MOSFET |
| Drain-Source Voltage | 45V |
| Continuous Drain Current | 18A |
| Continuous Drain Current @ Tc=100°C | 11.9A |
| Pulsed Drain Current | 72A |
| Gate-Source Voltage | ±18V |
| Single Pulse Avalanche Energy | 115.5mJ |
| Power Dissipation | 3.1W |
| Operating Junction Temperature Range | -55 to 150°C |
| Drain-Source On-Resistance Typ @ VGS=10V | 5.2mΩ |
| Drain-Source On-Resistance Max @ VGS=10V | 6.5mΩ |
| Drain-Source On-Resistance Typ @ VGS=4.5V | 8.0mΩ |
| Drain-Source On-Resistance Max @ VGS=4.5V | 9.8mΩ |
| Gate Threshold Voltage | 1.0 to 2.5V |
| Input Capacitance | 1156pF |
| Output Capacitance | 493pF |
| Reverse Transfer Capacitance | 32pF |
| Total Gate Charge | 24nC |
| Gate-Source Charge | 3.2nC |
| Gate-Drain Charge | 6.7nC |
| Turn-on Delay Time | 10.4ns |
| Rise Time | 6ns |
| Turn-off Delay Time | 30.8ns |
| Fall Time | 6.4ns |
| Body Diode Forward Voltage | 1.2V |
| Reverse Recovery Time | 41.9ns |
| Reverse Recovery Charge | 40nC |
| Thermal Resistance Junction-to-Ambient | 40°C/W |
| RoHS | Compliant |
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