This silicon N-channel enhanced VDMOSFET uses high-density trench technology to reduce conduction loss and improve switching performance. It is rated for 60 V drain-to-source voltage, 14 A continuous drain current at 25 °C, and 3.1 W power dissipation. Typical on-resistance is 8.5 mΩ at VGS = 10 V and 11 mΩ at VGS = 4.5 V, with 18 nC total gate charge and 1226 pF input capacitance. The device is supplied in an SOP-8 package, supports single-pulse avalanche energy to 145 mJ, operates to 150 °C junction temperature, and is intended for adapter, charger, and DC/DC synchronous rectification circuits.
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China Resource Microelectronics HGE090N06A technical specifications.
| Channel Type | N-Channel |
| Drain-Source Voltage | 60V |
| Continuous Drain Current | 14A |
| Continuous Drain Current at 100°C | 9.6A |
| Pulsed Drain Current | 56A |
| Gate-Source Voltage | ±20V |
| Single Pulse Avalanche Energy | 145mJ |
| Power Dissipation | 3.1W |
| On-Resistance at VGS=10V (typ) | 8.5mΩ |
| On-Resistance at VGS=10V (max) | 9.8mΩ |
| On-Resistance at VGS=4.5V (typ) | 11mΩ |
| On-Resistance at VGS=4.5V (max) | 13.5mΩ |
| Gate Threshold Voltage | 1.0 to 2.5V |
| Total Gate Charge | 18nC |
| Input Capacitance | 1226pF |
| Output Capacitance | 348pF |
| Reverse Transfer Capacitance | 9.97pF |
| Reverse Recovery Time | 42ns |
| Reverse Recovery Charge | 52.5nC |
| Junction-to-Ambient Thermal Resistance | 40°C/W |
| RoHS | Compliant |
| Halogen Free | Yes |
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