Sn63/Pb37 leaded solder paste with synthetic no-clean flux. Designed for printing at speeds up to 100mm/sec with a wide process window and clear residue. Features low voiding and excellent wetting compatibility on most board finishes.
Sign in to ask questions about the Chip Quik SMD291AX50T3 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Chip Quik SMD291AX50T3 technical specifications.
| Alloy | Sn63/Pb37 |
| Melting Point | 183°C |
| Flux Type | Synthetic No-Clean (REL0) |
| Mesh Size | T3mesh |
| Micron Range | 25-45µm |
| Metal Load | 90.25 (by weight)% |
| Shelf Life (Refrigerated) | >12months |
| Storage Temperature | 3-8°C |
| RoHS | Compliant (Leaded) |
| Flux Classification | REL0 |
Download the complete datasheet for Chip Quik SMD291AX50T3 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
