Chip Quik SMDSWLTLFP32 is a low temperature lead-free solder wire designed for heat-sensitive components. It consists of a Tin/Bismuth/Silver alloy (Sn42/Bi57.6/Ag0.4) with a synthetic no-clean flux core. This wire features a low melting point of 138°C (281°F), making it ideal for SMD rework and projects where thermal damage must be avoided.
Chip Quik SMDSWLTLFP32 technical specifications.
| Alloy | Sn42/Bi57.6/Ag0.4 |
| Melting Point | 138°C |
| Wire Diameter | 0.8mm |
| Wire Diameter | 0.032in |
| Flux Type | Synthetic No-Clean |
| Flux Core | 2.2% |
| Net Weight | 1lb |
| RoHS | RoHS 3 Compliant |
| REACH | Compliant |
| Lead-free | Yes |
No datasheet is available for this part.
