BLAS-26JLLB460
Microchip
PCN #: BLAS-26JLLB460
Product Change NoticeMicrochip
Microchip PCN BLAS-26JLLB460 Lead-Frame Pre and Post Change Summary
Comparison of lead-frame specifications for Microchip CCB 8213, including changes to paddle size and Die Attach Paddle (DAP) surface preparation.
Overview
This Product Change Notice (PCN) document details lead-frame modifications under CCB 8213 for Microchip components. The lead-frame paddle size is increasing from 95 x 155 to 95 x 173, and the Die Attach Paddle (DAP) surface preparation is changing from silver (Ag) plated to Ag selective. The lead-frame material remains CDA194. The updated design includes a leadlock hole filled with mold compound to provide improved protection against moisture penetration along the package leads.
Use Cases
- Evaluating manufacturing changes for Microchip components
- Assessing package reliability and moisture sensitivity levels
- Updating internal component specifications and procurement records
Topics
Microchip
PCN
BLAS-26JLLB460
CCB 8213
lead-frame
CDA194
DAP surface prep
paddle size
moisture protection
semiconductor packaging
Referenced Parts
CDA194
Microchip
Lead-Frame Material CDA194
| BLAS-26JLLB460 | Microchip | PCN #: BLAS-26JLLB460 |
| CDA194 | Microchip | Lead-Frame Material CDA194 |