CAAN-03OQBK734
Microchip
PCN #: CAAN-03OQBK734
Product Change NoticeMicrochip
Microchip PCN CAAN-03OQBK734: Lead-Frame Pre and Post Change Summary
Comparison of lead-frame changes for Microchip products, detailing the transition from NSEB (UTL-1) to MMT assembly sites and modifications to lead lock design.
Overview
This Product Change Notice (PCN) CAAN-03OQBK734, corresponding to CCB 8225, details the pre- and post-change lead-frame specifications for Microchip semiconductor assembly. The document compares the NSEB (UTL-1) site with the MMT site. While the lead-frame material remains EFTEC-64T for both, the lead lock mechanism changes from a dimple design at NSEB to a half-etched design at MMT.
Use Cases
- Reviewing semiconductor assembly site transitions
- Verifying lead-frame material and mechanical design changes
- Supply chain and quality assurance monitoring
- Technical documentation for component lifecycle management
Topics
Microchip
PCN CAAN-03OQBK734
CCB 8225
Lead-Frame
EFTEC-64T
NSEB
UTL-1
MMT
Lead Lock
Half Etched
Dimple
Referenced Parts
EFTEC-64T
Microchip
Lead-Frame Material EFTEC-64T
UTL-1
Microchip
NSEB (UTL-1) MMT
| CAAN-03OQBK734 | Microchip | PCN #: CAAN-03OQBK734 |
| EFTEC-64T | Microchip | Lead-Frame Material EFTEC-64T |
| UTL-1 | Microchip | NSEB (UTL-1) MMT |