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Product Change NoticeMicrochip

Microchip PCN CAAN-07WTTK189: Lead Frame Pre and Post Change Summary

Microchip product change notice detailing lead frame differences between ASE and MTAI assembly sites, specifically the addition of a half-etched lead-lock feature.

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Overview

This product change notice (PCN CAAN-07WTTK189) provides a comparison of lead frame designs between the ASE and MTAI assembly sites. The document specifies that both sites use A194 lead frame material. The primary difference noted is the implementation of a half-etched lead-lock feature at the MTAI site, which is not present in the ASE assembly lead frame design.

Use Cases

  • Manufacturing quality control
  • Supply chain management
  • Assembly site qualification
  • Component reliability assessment

Topics

Microchip
PCN CAAN-07WTTK189
lead frame
A194
lead-lock
ASE
MTAI
assembly site
semiconductor packaging

Referenced Parts

A194

Microchip

Lead frame material A194

CAAN-07WTTK189

Microchip

PCN #: CAAN-07WTTK189

Microchip PCN CAAN-07WTTK189: Lead Frame Pre and Post Change Summary | Design Resources