Product Change NoticeMicrochip

Microchip PCN CAAN-11OPVN072 Qualification Plan: MTAI Assembly Site for SAMC20, SAMC21, and SAMD21

Qualification plan for MTAI as an additional assembly site for Microchip SAMC20, SAMC21, and SAMD21 microcontrollers in 64L VQFN packages.

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Overview

This document outlines the qualification plan (PCN CAAN-11OPVN072) to establish MTAI as an additional assembly site for selected Microchip ATSAMC20, ATSAMC21, and ATSAMD21 device families. The affected microcontrollers are housed in 64L VQFN (9x9x0.9mm) packages. The plan specifies the use of CuPdAu bond wire, QMI519 PFAS-free die attach material, and G700LTD mold compound. Evaluation criteria include High Temperature Storage Life (HTSL), Preconditioning, HAST, uHAST, and Temperature Cycling, adhering to AEC-Q100 Grade 1 standards and JEDEC specifications.

Use Cases

Supply chain risk management and assembly site diversification
Verifying material compliance for CuPdAu bond wire transitions
Qualifying ATSAMD21 and ATSAMC21 series components for automotive Grade 1 applications
Manufacturing process documentation for electronics procurement

Topics

Microchip

PCN

ATSAMC20J17A

ATSAMC21J18A

ATSAMD21J18

64L VQFN

CuPdAu

MTAI

qualification plan

AEC-Q100

microcontroller

Referenced Parts

ATSAMC20J16A

Microchip

Qualification of MTAI as an additional assembly site for selected ATSAMC20J16A

ATSAMC20J17A

Microchip

Qualification of MTAI as an additional assembly site for selected ATSAMC20J16A, ATSAMC20J17A

ATSAMC20J17A-MZVAO

Microchip

Part Number (CPN) ATSAMC20J17A-MZVAO

ATSAMC21J15A

Microchip

selected ATSAMC20J16A, ATSAMC20J17A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A

ATSAMC21J16A

Microchip

selected ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A

ATSAMC21J17A

Microchip

selected ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A

ATSAMC21J18A

Microchip

selected ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A

ATSAMD21J15

Microchip

ATSAMD21J15, ATSAMD21J16, ATSAMD21J17 and ATSAMD21J18

ATSAMD21J16

Microchip

ATSAMD21J15, ATSAMD21J16, ATSAMD21J17 and ATSAMD21J18

ATSAMD21J17

Microchip

ATSAMD21J15, ATSAMD21J16, ATSAMD21J17 and ATSAMD21J18

ATSAMD21J18

Microchip

ATSAMD21J15, ATSAMD21J16, ATSAMD21J17 and ATSAMD21J18

193x193

Microchip

193x193 mils

64L

Microchip

ATSAMD21J17 and ATSAMD21J18 device families available in 64L VQFN (9x9x0.9mm) package.

64L

Microchip

device families available in 64L VQFN (9x9x0.9mm) package.

9x9x0.9mm

Microchip

device families available in 64L VQFN (9x9x0.9mm) package.

9x9x0.9mm

Microchip

ATSAMD21J17 and ATSAMD21J18 device families available in 64L VQFN (9x9x0.9mm) package.

A101

Microchip

uHAST JESD22-A102, A118, or A101

A110

Microchip

HAST JESD22-A101 or A110

A118

Microchip

uHAST JESD22-A102, A118, or A101

AEC-Q006.

Microchip

Grade 1: +25°C, +130°C 77 5 3 246 0 15 - 120 MPHL MPHL VQFN Perform per the requirements in AEC-Q006.

AEC-Q006.

Microchip

77 5 3 246 0 10 - 22 MPHL MPHL Perform per the requirements in AEC-Q006.

AEC-Q100/Q101.

Microchip

45 5 3 150 0 21 - 167 MPHL MPHL VQFN Perform per the requirements in AEC-Q100/Q101.

ATSAMC20J16A

Microchip

ATSAMC20J16A, ATSAMC20J17A, ATSAMC21J15A,

ATSAMC20J16A

Microchip

Purpose: Qualification of MTAI as an additional assembly site for selected ATSAMC20J16A, ATSAMC20J17A,

ATSAMC20J17A

Microchip

ATSAMC20J16A, ATSAMC20J17A, ATSAMC21J15A,

ATSAMC20J17A

Microchip

Purpose: Qualification of MTAI as an additional assembly site for selected ATSAMC20J16A, ATSAMC20J17A,

ATSAMC21J15A

Microchip

ATSAMC20J16A, ATSAMC20J17A, ATSAMC21J15A,

ATSAMC21J15A

Microchip

ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,

ATSAMC21J16A

Microchip

ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,

ATSAMC21J16A

Microchip

ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A,

ATSAMC21J17A

Microchip

ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,

ATSAMC21J17A

Microchip

ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A,

ATSAMC21J18A

Microchip

ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A,

ATSAMC21J18A

Microchip

ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,

ATSAMD21J15

Microchip

ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,

ATSAMD21J16

Microchip

ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,

ATSAMD21J17

Microchip

ATSAMD21J17 and ATSAMD21J18 device families available in 64L VQFN (9x9x0.9mm) package.

ATSAMD21J18

Microchip

ATSAMD21J17 and ATSAMD21J18 device families available in 64L VQFN (9x9x0.9mm) package.

B100

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5 MPHL VQFN

B108

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5 MPHL VQFN

CAAN-11OPVN072

Microchip

PCN#: CAAN-11OPVN072

CDF-AEC-Q100-001

Microchip

Wire Bond Shear - WBS CDF-AEC-Q100-001 5 0 1 5 0 5 MTAI VQFN 30 bonds from a min. 5 devices.

G700LTD

Microchip

MC G700LTD

J-STD-002E

Microchip

Standard Pb-free Solderability J-STD-002E ; Perform 8 hours of steam aging for Matte tin finish and 1 hour steam aging for

JESD22

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5 MPHL VQFN

JESD22-A101

Microchip

HAST JESD22-A101 or A110

JESD22-A102

Microchip

uHAST JESD22-A102, A118, or A101

JESD22-A104

Microchip

Temp Cycle JESD22-A104

Jedec-STD-020E

Microchip

temperature per Jedec-STD-020E for package type.

QMI519

Microchip

QMI519 (PFAS-Free)

ATSAMC20J16A	Microchip	Qualification of MTAI as an additional assembly site for selected ATSAMC20J16A
ATSAMC20J17A	Microchip	Qualification of MTAI as an additional assembly site for selected ATSAMC20J16A, ATSAMC20J17A
ATSAMC20J17A-MZVAO	Microchip	Part Number (CPN) ATSAMC20J17A-MZVAO
ATSAMC21J15A	Microchip	selected ATSAMC20J16A, ATSAMC20J17A, ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A
ATSAMC21J16A	Microchip	selected ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A
ATSAMC21J17A	Microchip	selected ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A
ATSAMC21J18A	Microchip	selected ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A
ATSAMD21J15	Microchip	ATSAMD21J15, ATSAMD21J16, ATSAMD21J17 and ATSAMD21J18
ATSAMD21J16	Microchip	ATSAMD21J15, ATSAMD21J16, ATSAMD21J17 and ATSAMD21J18
ATSAMD21J17	Microchip	ATSAMD21J15, ATSAMD21J16, ATSAMD21J17 and ATSAMD21J18
ATSAMD21J18	Microchip	ATSAMD21J15, ATSAMD21J16, ATSAMD21J17 and ATSAMD21J18
193x193	Microchip	193x193 mils
64L	Microchip	ATSAMD21J17 and ATSAMD21J18 device families available in 64L VQFN (9x9x0.9mm) package.
64L	Microchip	device families available in 64L VQFN (9x9x0.9mm) package.
9x9x0.9mm	Microchip	device families available in 64L VQFN (9x9x0.9mm) package.
9x9x0.9mm	Microchip	ATSAMD21J17 and ATSAMD21J18 device families available in 64L VQFN (9x9x0.9mm) package.
A101	Microchip	uHAST JESD22-A102, A118, or A101
A110	Microchip	HAST JESD22-A101 or A110
A118	Microchip	uHAST JESD22-A102, A118, or A101
AEC-Q006.	Microchip	Grade 1: +25°C, +130°C 77 5 3 246 0 15 - 120 MPHL MPHL VQFN Perform per the requirements in AEC-Q006.
AEC-Q006.	Microchip	77 5 3 246 0 10 - 22 MPHL MPHL Perform per the requirements in AEC-Q006.
AEC-Q100/Q101.	Microchip	45 5 3 150 0 21 - 167 MPHL MPHL VQFN Perform per the requirements in AEC-Q100/Q101.
ATSAMC20J16A	Microchip	ATSAMC20J16A, ATSAMC20J17A, ATSAMC21J15A,
ATSAMC20J16A	Microchip	Purpose: Qualification of MTAI as an additional assembly site for selected ATSAMC20J16A, ATSAMC20J17A,
ATSAMC20J17A	Microchip	ATSAMC20J16A, ATSAMC20J17A, ATSAMC21J15A,
ATSAMC20J17A	Microchip	Purpose: Qualification of MTAI as an additional assembly site for selected ATSAMC20J16A, ATSAMC20J17A,
ATSAMC21J15A	Microchip	ATSAMC20J16A, ATSAMC20J17A, ATSAMC21J15A,
ATSAMC21J15A	Microchip	ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,
ATSAMC21J16A	Microchip	ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,
ATSAMC21J16A	Microchip	ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A,
ATSAMC21J17A	Microchip	ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,
ATSAMC21J17A	Microchip	ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A,
ATSAMC21J18A	Microchip	ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A,
ATSAMC21J18A	Microchip	ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,
ATSAMD21J15	Microchip	ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,
ATSAMD21J16	Microchip	ATSAMC21J15A, ATSAMC21J16A, ATSAMC21J17A, ATSAMC21J18A, ATSAMD21J15, ATSAMD21J16,
ATSAMD21J17	Microchip	ATSAMD21J17 and ATSAMD21J18 device families available in 64L VQFN (9x9x0.9mm) package.
ATSAMD21J18	Microchip	ATSAMD21J17 and ATSAMD21J18 device families available in 64L VQFN (9x9x0.9mm) package.
B100	Microchip	Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5 MPHL VQFN
B108	Microchip	Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5 MPHL VQFN
CAAN-11OPVN072	Microchip	PCN#: CAAN-11OPVN072
CDF-AEC-Q100-001	Microchip	Wire Bond Shear - WBS CDF-AEC-Q100-001 5 0 1 5 0 5 MTAI VQFN 30 bonds from a min. 5 devices.
G700LTD	Microchip	MC G700LTD
J-STD-002E	Microchip	Standard Pb-free Solderability J-STD-002E ; Perform 8 hours of steam aging for Matte tin finish and 1 hour steam aging for
JESD22	Microchip	Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5 MPHL VQFN
JESD22-A101	Microchip	HAST JESD22-A101 or A110
JESD22-A102	Microchip	uHAST JESD22-A102, A118, or A101
JESD22-A104	Microchip	Temp Cycle JESD22-A104
Jedec-STD-020E	Microchip	temperature per Jedec-STD-020E for package type.
QMI519	Microchip	QMI519 (PFAS-Free)