Skip to main content
Product Change NoticeMicrochip

Microchip PCN DSNO-09GUUD527: MMT Assembly Site Qualification for 8L WSON Flash Memory

Qualification plan for Microchip MMT as an additional assembly site for selected SST26 and SST25 Flash memory families in 8L WSON packages to AEC-Q006 Grade 1 standards.

View product change notice

Overview

This document outlines the qualification plan (PCN DSNO-09GUUD527) for adding MMT (Microchip Thailand) as an additional assembly site for several Microchip serial Flash memory families, including SST26WF, SST26VF, SST25VF, and SST25PF. The qualification applies to devices in 8-lead WSON (6x5x0.8mm) packages. The plan details reliability stress tests required for AEC-Q006 Grade 1 compliance, including High Temperature Storage Life (HTSL), Temperature Cycling, uHAST, and HAST. Assembly materials specified include CuPdAu bond wire, PFAS-free QMI519 die attach, and G700LTD mold compound with a matte tin lead finish.

Use Cases

  • Supply chain diversification
  • Automotive grade qualification verification
  • Component reliability assessment

Topics

Microchip
SST26WF016B
SST26VF064B
SST25VF080B
8L WSON
MMT assembly site
AEC-Q006 Grade 1
serial Flash
qualification plan

Referenced Parts

SST25PF020B

Microchip

SST26VF064BA and SST25PF020B device families

SST25VF020B

Microchip

SST25VF020B, SST25VF040B,

SST25VF040B

Microchip

SST25VF040B, SST26VF064B,

SST25VF080B

Microchip

SST25VF080B, SST25VF020B,

SST26VF016B

Microchip

SST26VF016B, SST26VF080A,

SST26VF020A

Microchip

SST26VF020A, SST25VF080B,

SST26VF032B

Microchip

SST26VF032B, SST26VF032BA,

SST26VF032BA

Microchip

SST26VF032BA, SST26WF064C,

SST26VF040A

Microchip

SST26VF040A, SST26VF020A,

SST26VF064B

Microchip

SST26VF064B, SST26VF064BA

SST26VF064B-104V/MF70SV01

Microchip

SST26VF064B-104V/MF70SV01

SST26VF064BA

Microchip

SST26VF064BA and SST25PF020B device families

SST26VF064BEUI

Microchip

SST26VF064BEUI, SST26VF016B,

SST26VF080A

Microchip

SST26VF080A, SST26VF040A,

SST26WF016B

Microchip

Qualification of MMT as an additional assembly site for selected SST26WF016B

SST26WF016BA

Microchip

SST26WF016BA, SST26WF080B,

SST26WF040B

Microchip

SST26WF080BA, SST26WF040B, SST26WF040BA,

SST26WF040BA

Microchip

SST26WF040BA, SST26VF032B,

SST26WF064C

Microchip

SST26WF064C, SST26VF064BEUI,

SST26WF080B

Microchip

SST26WF016BA, SST26WF080B, SST26WF080BA,

SST26WF080BA

Microchip

SST26WF080BA, SST26WF040B,

1st

Microchip

1st Readpoint:

2nd

Microchip

2nd Readpoint:

6x5x0.8mm

Microchip

in 8L WSON (6x5x0.8mm) package. This is Q006 Grade 1 qualification.

6x5x0.8mm

Microchip

available in 8L WSON (6x5x0.8mm) package. This is Q006

A101

Microchip

uHAST JESD22-A102, A118, or A101

A110

Microchip

HAST JESD22-A101 or A110

A118

Microchip

uHAST JESD22-A102, A118, or A101

AEC-Q006.

Microchip

Grade 1: +25°C, +85°C, +125°C 77 Perform per the requirements in AEC-Q006.

AEC-Q006.

Microchip

Grade 1: +25°C,+85°C, +125°C 77 5 3 246 0 15 - 120 Perform per the requirements in AEC-Q006.

B100

Microchip

Measure per JESD22 B100 and B108 10 0 3 30 0 5

B108

Microchip

Measure per JESD22 B100 and B108 10 0 3 30 0 5

CDF-AEC-Q100-001

Microchip

CDF-AEC-Q100-001 5 0 1 5 0 5 30 bonds from a min. 5 devices.

DSNO-09GUUD527

Microchip

PCN #: DSNO-09GUUD527

G700LTD

Microchip

MC G700LTD

J-STD-002D

Microchip

J-STD-002D ; Perform 8 hours of steam aging for Matte tin

JESD22

Microchip

Measure per JESD22 B100 and B108 10 0 3 30 0 5

JESD22-A101

Microchip

HAST JESD22-A101 or A110

JESD22-A102

Microchip

uHAST JESD22-A102, A118, or A101

JESD22-A104

Microchip

Temp Cycle JESD22-A104

Jedec-STD-020E

Microchip

Jedec-STD-020E for package type.

Q006

Microchip

available in 8L WSON (6x5x0.8mm) package. This is Q006

Q006

Microchip

in 8L WSON (6x5x0.8mm) package. This is Q006 Grade 1 qualification.

QMI519

Microchip

QMI519 (PFAS Free)

SST25PF020B

Microchip

SST25VF040B, SST26VF064B, SST26VF064BA and SST25PF020B device families available

SST25VF020B

Microchip

SST25VF020B, SST25VF040B, SST26VF064B,

SST25VF020B

Microchip

SST26VF080A, SST26VF040A, SST26VF020A, SST25VF080B, SST25VF020B,

SST25VF040B

Microchip

SST25VF020B, SST25VF040B, SST26VF064B,

SST25VF040B

Microchip

SST25VF040B, SST26VF064B, SST26VF064BA and SST25PF020B device families available

SST25VF080B

Microchip

SST26VF040A, SST26VF020A, SST25VF080B,

SST25VF080B

Microchip

SST26VF080A, SST26VF040A, SST26VF020A, SST25VF080B, SST25VF020B,

SST26VF016B

Microchip

SST26VF032B, SST26VF032BA, SST26WF064C, SST26VF064BEUI, SST26VF016B,

SST26VF016B

Microchip

SST26VF064BEUI, SST26VF016B, SST26VF080A,

SST26VF020A

Microchip

SST26VF080A, SST26VF040A, SST26VF020A, SST25VF080B, SST25VF020B,

SST26VF020A

Microchip

SST26VF040A, SST26VF020A, SST25VF080B,

SST26VF032B

Microchip

SST26VF032B, SST26VF032BA, SST26WF064C,

SST26VF032B

Microchip

SST26VF032B, SST26VF032BA, SST26WF064C, SST26VF064BEUI, SST26VF016B,

SST26VF032BA

Microchip

SST26VF032B, SST26VF032BA, SST26WF064C, SST26VF064BEUI, SST26VF016B,

SST26VF032BA

Microchip

SST26VF032B, SST26VF032BA, SST26WF064C,

SST26VF040A

Microchip

SST26VF080A, SST26VF040A, SST26VF020A, SST25VF080B, SST25VF020B,

SST26VF040A

Microchip

SST26VF040A, SST26VF020A, SST25VF080B,

SST26VF064B

Microchip

SST25VF020B, SST25VF040B, SST26VF064B,

SST26VF064B

Microchip

SST25VF040B, SST26VF064B, SST26VF064BA and SST25PF020B device families available

SST26VF064BA

Microchip

SST25VF040B, SST26VF064B, SST26VF064BA and SST25PF020B device families available

SST26VF064BEUI

Microchip

SST26VF064BEUI, SST26VF016B, SST26VF080A,

SST26VF064BEUI

Microchip

SST26VF032B, SST26VF032BA, SST26WF064C, SST26VF064BEUI, SST26VF016B,

SST26VF080A

Microchip

SST26VF080A, SST26VF040A, SST26VF020A, SST25VF080B, SST25VF020B,

SST26VF080A

Microchip

SST26VF064BEUI, SST26VF016B, SST26VF080A,

SST26WF016B

Microchip

selected SST26WF016B, SST26WF016BA, SST26WF080B,

SST26WF016B

Microchip

Qualification of MMT as an additional assembly site for selected SST26WF016B,

SST26WF016BA

Microchip

SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA,

SST26WF016BA

Microchip

selected SST26WF016B, SST26WF016BA, SST26WF080B,

SST26WF040B

Microchip

SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA,

SST26WF040BA

Microchip

SST26WF080BA, SST26WF040B, SST26WF040BA,

SST26WF040BA

Microchip

SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA,

SST26WF064C

Microchip

SST26VF032B, SST26VF032BA, SST26WF064C,

SST26WF064C

Microchip

SST26VF032B, SST26VF032BA, SST26WF064C, SST26VF064BEUI, SST26VF016B,

SST26WF080B

Microchip

SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA,

SST26WF080B

Microchip

selected SST26WF016B, SST26WF016BA, SST26WF080B,

SST26WF080BA

Microchip

SST26WF080BA, SST26WF040B, SST26WF040BA,

SST26WF080BA

Microchip

SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA,

Microchip PCN DSNO-09GUUD527: MMT Assembly Site Qualification for 8L WSON Flash Memory | Design Resources