0.048+/-0.005mm
Microchip
HANA 13.3±0.10 0.048+/-0.005mm Clear Heat sealing
Product Change NoticeMicrochip
Microchip PCN NTDO-22LDBT197: Pre and Post Change Summary for Packaging and Packing Methods
Comparison of packaging and packing method changes for Microchip products transitioning from GTBF to HANA facilities, including tape, reel, and bag specification updates.
Overview
This Product Change Notice (PCN) document, identified as NTDO-22LDBT197 (CCB 7676), provides a detailed pre- and post-change comparison for packaging and packing methods. The changes reflect a transition from the GTBF plant to the HANA plant. Key technical adjustments include carrier tape dimensional changes (A0 from 7.10mm to 7.21mm, K0 from 2.20mm to 1.95mm), cover tape thickness reduction from 0.062mm to 0.048mm, and modifications to aluminum foil bag dimensions and inner box sizes. Pin #1 orientation remains consistent in Quadrant 3. The document also specifies reel diameter, hub size, and sealing methodologies used at the new facility.
Use Cases
- Incoming inspection and verification of packaging dimensions
- Quality assurance review for manufacturing site transitions
- Logistics and warehouse storage planning based on new box and reel dimensions
- Manufacturing process adjustment for automated pick-and-place feeders
Topics
Microchip
PCN NTDO-22LDBT197
Product Change Notice
Tape and Reel
Carrier Tape
Cover Tape
Packing Method
GTBF
HANA
Pin Orientation
Referenced Parts
0.062+/-0.013mm
Microchip
GTBF 13.3 +/-0.10 0.062+/-0.013mm Clear Heat sealing
LEVEL3
Microchip
LEVEL3 Label
NTDO-22LDBT197
Microchip
PCN# NTDO-22LDBT197
PIN#1
Microchip
PIN#1 Orientation
W14
Microchip
• PROTECTIVE BAND W14
| 0.048+/-0.005mm | Microchip | HANA 13.3±0.10 0.048+/-0.005mm Clear Heat sealing |
| 0.062+/-0.013mm | Microchip | GTBF 13.3 +/-0.10 0.062+/-0.013mm Clear Heat sealing |
| LEVEL3 | Microchip | LEVEL3 Label |
| NTDO-22LDBT197 | Microchip | PCN# NTDO-22LDBT197 |
| PIN#1 | Microchip | PIN#1 Orientation |
| W14 | Microchip | • PROTECTIVE BAND W14 |