Microchip Qualification Plan for Additional Assembly Site (UTL3) - SHA106 and ECC206 VSFN Packages
Qualification plan for Microchip SHA106 and ECC206 security devices in 2L VSFN packages, adding UTL3 as an assembly site and UTL2 for SMT processing.
Overview
This qualification plan (PCN MFOL-10OIJT490) details the addition of UTL3 as an assembly site and UTL2 for SMT processing for Microchip SHA106-MCVCZ-B, ECC206-MCVCZ-B, and SHA106-MCV9L-B devices in 2L VSFN (2x2.35x0.85mm) packaging. The document specifies material sets including C194 lead-frames with NiPdAu plating, CuPdAu bond wires, and G700LTD mold compound. It outlines a rigorous reliability testing schedule including Solderability, Wire Bond Pull/Shear, High Temperature Storage Life (HTSL), MSL-1 Preconditioning, HAST, UHAST, and Temperature Cycling to ensure quality standards across the new manufacturing sites.
Use Cases
- Supply chain verification for security ICs
- Evaluating manufacturing site redundancy
- Reviewing reliability test parameters for VSFN packages
- Quality assurance compliance
Topics
Referenced Parts
ECC206-MCVCZ-B
Microchip
catalog part numbers (CPN) available in 2L VSFN (2x2.35x0.85mm) package.
SHA106-MCV9L-B
Microchip
catalog part numbers (CPN) available in 2L VSFN (2x2.35x0.85mm) package.
SHA106-MCVCZ-B
Microchip
catalog part numbers (CPN) available in 2L VSFN (2x2.35x0.85mm) package.
105C
Microchip
+25C and hot temp (105C max)
105C
Microchip
temp (105C max); 3 gram force WBP,
105C
Microchip
+25°C and hot temp (105C max)
2x2.35x0.85mm
Microchip
PKG width/size 2x2.35x0.85mm
2x2.35x0.85mm
Microchip
(2x2.35x0.85mm) package.
2x2.35x0.85mm
Microchip
available in 2L VSFN (2x2.35x0.85mm) package.
70x250mm
Microchip
Strip Size 70x250mm
B100
Microchip
Physical Dimension Measure per JESD22 B100 and B108 10 0 3 30 5
B108
Microchip
Physical Dimension Measure per JESD22 B100 and B108 10 0 3 30 5
BD-004296
Microchip
BD Number BD-004296 rev.01
C194
Microchip
Material C194
CDF-AEC-Q100-001
Microchip
CDF-AEC-Q100-001 5 0 1 5 5 30 bonds from a min. 5 devices.
ECC206-MCVCZ-B
Microchip
SHA106-MCVCZ-B, ECC206-MCVCZ-B, and SHA106-
ECC206-MCVCZ-B
Microchip
ECC206-MCVCZ-B, and SHA106-MCV9L-B catalog part numbers (CPN)
FR1642
Microchip
Part Number FR1642
G700LTD
Microchip
MC Part Number G700LTD
GRM033C80J333KE01D
Microchip
Capacitor Part Number GRM033C80J333KE01D (use solder
HR-5104
Microchip
Die Attach Part Number HR-5104
J-STD-002E
Microchip
J-STD-002E ; Perform 8 hour steam
JESD22
Microchip
Physical Dimension Measure per JESD22 B100 and B108 10 0 3 30 5
JESD22-A103.
Microchip
JESD22-A103. +175 C for 504 hours or
JESD22-A104.
Microchip
Temp Cycle JESD22-A104. -65°C to +150°C for 500
JESD22-A110.
Microchip
HAST JESD22-A110. +130°C/85% RH for 96
JESD22-A113.
Microchip
JESD22-A113. +150°C Bake for 24
Jedec-STD-020E
Microchip
temperature per Jedec-STD-020E for
MCV9L-B
Microchip
MCV9L-B catalog part numbers (CPN) available in 2L VSFN
MFOL-10OIJT490
Microchip
PCN #: MFOL-10OIJT490
MSL-1
Microchip
MSL-1 @260C
MSL-1
Microchip
MSL information MSL-1 @260C
SHA106-
Microchip
SHA106-MCVCZ-B, ECC206-MCVCZ-B, and SHA106-
SHA106-MCV9L-B
Microchip
ECC206-MCVCZ-B, and SHA106-MCV9L-B catalog part numbers (CPN)
SHA106-MCVCZ-B
Microchip
Purpose: Qualification of UTL3 as an additional assembly site for SHA106-MCVCZ-B,
SHA106-MCVCZ-B
Microchip
SHA106-MCVCZ-B, ECC206-MCVCZ-B, and SHA106-
UTL-2
Microchip
SMT at UTL-2
UTL-3
Microchip
Assembly site Assembly at UTL-3,
UTL3
Microchip
Qualification of UTL3 as an additional assembly site for
UTL3
Microchip
Purpose: Qualification of UTL3 as an additional assembly site for SHA106-MCVCZ-B,
rev.01
Microchip
BD Number BD-004296 rev.01
G700LTD
Sumitomo Bakelite
MC Part Number G700LTD
HR-5104
Henkel
Die Attach Part Number HR-5104
FR1642
Microchip
Lead-Frame ... Part Number FR1642
| GRM033C80J333KE01D | Murata | Capacitor Part Number GRM033C80J333KE01D (use solder paste SAC 305) |
| ECC206-MCVCZ-B | Microchip | catalog part numbers (CPN) available in 2L VSFN (2x2.35x0.85mm) package. |
| SHA106-MCV9L-B | Microchip | catalog part numbers (CPN) available in 2L VSFN (2x2.35x0.85mm) package. |
| SHA106-MCVCZ-B | Microchip | catalog part numbers (CPN) available in 2L VSFN (2x2.35x0.85mm) package. |
| 105C | Microchip | +25C and hot temp (105C max) |
| 105C | Microchip | temp (105C max); 3 gram force WBP, |
| 105C | Microchip | +25°C and hot temp (105C max) |
| 2x2.35x0.85mm | Microchip | PKG width/size 2x2.35x0.85mm |
| 2x2.35x0.85mm | Microchip | (2x2.35x0.85mm) package. |
| 2x2.35x0.85mm | Microchip | available in 2L VSFN (2x2.35x0.85mm) package. |
| 70x250mm | Microchip | Strip Size 70x250mm |
| B100 | Microchip | Physical Dimension Measure per JESD22 B100 and B108 10 0 3 30 5 |
| B108 | Microchip | Physical Dimension Measure per JESD22 B100 and B108 10 0 3 30 5 |
| BD-004296 | Microchip | BD Number BD-004296 rev.01 |
| C194 | Microchip | Material C194 |
| CDF-AEC-Q100-001 | Microchip | CDF-AEC-Q100-001 5 0 1 5 5 30 bonds from a min. 5 devices. |
| ECC206-MCVCZ-B | Microchip | SHA106-MCVCZ-B, ECC206-MCVCZ-B, and SHA106- |
| ECC206-MCVCZ-B | Microchip | ECC206-MCVCZ-B, and SHA106-MCV9L-B catalog part numbers (CPN) |
| FR1642 | Microchip | Part Number FR1642 |
| G700LTD | Microchip | MC Part Number G700LTD |
| GRM033C80J333KE01D | Microchip | Capacitor Part Number GRM033C80J333KE01D (use solder |
| HR-5104 | Microchip | Die Attach Part Number HR-5104 |
| J-STD-002E | Microchip | J-STD-002E ; Perform 8 hour steam |
| JESD22 | Microchip | Physical Dimension Measure per JESD22 B100 and B108 10 0 3 30 5 |
| JESD22-A103. | Microchip | JESD22-A103. +175 C for 504 hours or |
| JESD22-A104. | Microchip | Temp Cycle JESD22-A104. -65°C to +150°C for 500 |
| JESD22-A110. | Microchip | HAST JESD22-A110. +130°C/85% RH for 96 |
| JESD22-A113. | Microchip | JESD22-A113. +150°C Bake for 24 |
| Jedec-STD-020E | Microchip | temperature per Jedec-STD-020E for |
| MCV9L-B | Microchip | MCV9L-B catalog part numbers (CPN) available in 2L VSFN |
| MFOL-10OIJT490 | Microchip | PCN #: MFOL-10OIJT490 |
| MSL-1 | Microchip | MSL-1 @260C |
| MSL-1 | Microchip | MSL information MSL-1 @260C |
| SHA106- | Microchip | SHA106-MCVCZ-B, ECC206-MCVCZ-B, and SHA106- |
| SHA106-MCV9L-B | Microchip | ECC206-MCVCZ-B, and SHA106-MCV9L-B catalog part numbers (CPN) |
| SHA106-MCVCZ-B | Microchip | Purpose: Qualification of UTL3 as an additional assembly site for SHA106-MCVCZ-B, |
| SHA106-MCVCZ-B | Microchip | SHA106-MCVCZ-B, ECC206-MCVCZ-B, and SHA106- |
| UTL-2 | Microchip | SMT at UTL-2 |
| UTL-3 | Microchip | Assembly site Assembly at UTL-3, |
| UTL3 | Microchip | Qualification of UTL3 as an additional assembly site for |
| UTL3 | Microchip | Purpose: Qualification of UTL3 as an additional assembly site for SHA106-MCVCZ-B, |
| rev.01 | Microchip | BD Number BD-004296 rev.01 |
| G700LTD | Sumitomo Bakelite | MC Part Number G700LTD |
| HR-5104 | Henkel | Die Attach Part Number HR-5104 |
| FR1642 | Microchip | Lead-Frame ... Part Number FR1642 |