MTD6508-ADJE/JQ
Microchip
Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for MTD6508-ADJE/JQ and MTD6508T-ADJE/JQ catalog part numbers (CPN)
Product Change NoticeMicrochip
Microchip Qualification Report: CuPdAu Wire Material for MTD6508-ADJE/JQ
Qualification report for Microchip MTD6508 series in 16L UQFN packaging using CuPdAu bond wire material, confirming MSL1 compliance and JEDEC reliability standards.
Overview
This qualification report summary details the transition to palladium-coated copper with gold flash (CuPdAu) bond wire for Microchip's MTD6508-ADJE/JQ and MTD6508T-ADJE/JQ parts in the 16L UQFN (4x4x0.5mm) package. Testing conducted at the MMT assembly site included moisture soak preconditioning (MSL1), high-temperature storage (175°C), temperature cycling (-55°C to +150°C), and both biased and unbiased HAST. Results indicate that the new wire material, paired with QMI519 die attach and G700LTD molding compound, meets all specified JEDEC and Mil-Standard requirements for electrical and physical reliability.
Use Cases
- Verifying material changes for Microchip motor driver ICs
- Assessing reliability data for copper bond wire transitions
- Validating MSL ratings for manufacturing reflow processes
- Compliance checking against JEDEC reliability standards
Topics
MTD6508-ADJE/JQ
MTD6508T-ADJE/JQ
CuPdAu
16L UQFN
MSL1
JESD22-A104
Biased HAST
Solderability
Microchip Reliability
PCN MAAN-05PFQZ171
Referenced Parts
MTD6508T-ADJE/JQ
Microchip
Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for MTD6508-ADJE/JQ and MTD6508T-ADJE/JQ catalog part numbers (CPN)
0Hr
Microchip
Physical Dimension (0Hr)
110x110
Microchip
Paddle size 110x110
16L
Microchip
part numbers (CPN) available in 16L UQFN 4x4x0.5mm) package at MMT
16L
Microchip
16L UQFN 4x4x0.5mm) package at MMT assembly site.
16L
Microchip
16L UQFN 4x4x0.5mm (JQX) package at MMT site is qualified for MSL1 at 260⁰C as per
250x70mm
Microchip
Strip Size 250x70mm
4x4x0.5mm
Microchip
PKG width/size 4x4x0.5mm
4x4x0.5mm
Microchip
part numbers (CPN) available in 16L UQFN 4x4x0.5mm) package at MMT
4x4x0.5mm
Microchip
16L UQFN 4x4x0.5mm) package at MMT assembly site.
4x4x0.5mm
Microchip
16L UQFN 4x4x0.5mm (JQX) package at MMT site is qualified for MSL1 at 260⁰C as per
5.5V
Microchip
Test Condition +130⁰C / 85%RH / 96 hours / Bias Voltage: 5.5V
B100
Microchip
Test Method JESD22 B100 and B108
B108
Microchip
Test Method JESD22 B100 and B108
BD-003741-01
Microchip
BD Number BD-003741-01
CDF-AEC-Q100-001
Microchip
Test Method CDF-AEC-Q100-001
EFTEC-64T
Microchip
Material EFTEC-64T
ETS88
Microchip
Tester: ETS88 25°C
ETS88
Microchip
Tester: ETS88 25°C and 125°C
G700LTD
Microchip
MC Part Number G700LTD
J-STD-002
Microchip
Test Method J-STD-002 / JESD22B-102
J-STD-020
Microchip
Test Method JESD22-A113, JEDEC J-STD-020
J-STD-020
Microchip
JEDEC J-STD-020 standard and is passed in accordance to Specified JEDEC and Mil
JESD22
Microchip
Test Method JESD22 B100 and B108
JESD22-A103
Microchip
Test Method JESD22-A103
JESD22-A104
Microchip
Test Method JESD22-A104
JESD22-A110
Microchip
Test Method JESD22-A110
JESD22-A113
Microchip
Test Method JESD22-A113, JEDEC J-STD-020
JESD22-A118
Microchip
Test Method JESD22-A118
JESD22B-102
Microchip
Test Method J-STD-002 / JESD22B-102
MAAN-05PFQZ171
Microchip
PCN #: MAAN-05PFQZ171
MSL1
Microchip
Test Condition MSL1: 150⁰C 24 hours Bake, 168 hours Moisture Soak at 85⁰C/85%RH,
MSL1
Microchip
16L UQFN 4x4x0.5mm (JQX) package at MMT site is qualified for MSL1 at 260⁰C as per
MTD6508T-ADJE/JQ
Microchip
wire material for MTD6508-ADJE/JQ and MTD6508T-ADJE/JQ catalog
MTD6508T-ADJE/JQ
Microchip
MTD6508T-ADJE/JQ catalog part numbers (CPN) available in
MTD6508T-ADJE/JQ
Microchip
Qualification of UGBC1 mask / MTD6508T-ADJE/JQ product / 0.8 mil CuPdAu wire in
QMI519
Microchip
Die Attach Part Number QMI519
R2600043-1
Microchip
Lot ID R2600043-1
UGBC1
Microchip
Qualification of UGBC1 mask / MTD6508T-ADJE/JQ product / 0.8 mil CuPdAu wire in
UGBC14JQXA00
Microchip
MP Code (MPC) UGBC14JQXA00
| MTD6508-ADJE/JQ | Microchip | Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for MTD6508-ADJE/JQ and MTD6508T-ADJE/JQ catalog part numbers (CPN) |
| MTD6508-ADJE/JQ | Microchip | (CuPdAu) as a new wire material for MTD6508-ADJE/JQ and |
| MTD6508-ADJE/JQ | Microchip | wire material for MTD6508-ADJE/JQ and MTD6508T-ADJE/JQ catalog |
| MTD6508-ADJE/JQ | Microchip | Part Number (CPN) MTD6508-ADJE/JQ |
| MTD6508T-ADJE/JQ | Microchip | Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for MTD6508-ADJE/JQ and MTD6508T-ADJE/JQ catalog part numbers (CPN) |
| 0Hr | Microchip | Physical Dimension (0Hr) |
| 110x110 | Microchip | Paddle size 110x110 |
| 16L | Microchip | part numbers (CPN) available in 16L UQFN 4x4x0.5mm) package at MMT |
| 16L | Microchip | 16L UQFN 4x4x0.5mm) package at MMT assembly site. |
| 16L | Microchip | 16L UQFN 4x4x0.5mm (JQX) package at MMT site is qualified for MSL1 at 260⁰C as per |
| 250x70mm | Microchip | Strip Size 250x70mm |
| 4x4x0.5mm | Microchip | PKG width/size 4x4x0.5mm |
| 4x4x0.5mm | Microchip | part numbers (CPN) available in 16L UQFN 4x4x0.5mm) package at MMT |
| 4x4x0.5mm | Microchip | 16L UQFN 4x4x0.5mm) package at MMT assembly site. |
| 4x4x0.5mm | Microchip | 16L UQFN 4x4x0.5mm (JQX) package at MMT site is qualified for MSL1 at 260⁰C as per |
| 5.5V | Microchip | Test Condition +130⁰C / 85%RH / 96 hours / Bias Voltage: 5.5V |
| B100 | Microchip | Test Method JESD22 B100 and B108 |
| B108 | Microchip | Test Method JESD22 B100 and B108 |
| BD-003741-01 | Microchip | BD Number BD-003741-01 |
| CDF-AEC-Q100-001 | Microchip | Test Method CDF-AEC-Q100-001 |
| EFTEC-64T | Microchip | Material EFTEC-64T |
| ETS88 | Microchip | Tester: ETS88 25°C |
| ETS88 | Microchip | Tester: ETS88 25°C and 125°C |
| G700LTD | Microchip | MC Part Number G700LTD |
| J-STD-002 | Microchip | Test Method J-STD-002 / JESD22B-102 |
| J-STD-020 | Microchip | Test Method JESD22-A113, JEDEC J-STD-020 |
| J-STD-020 | Microchip | JEDEC J-STD-020 standard and is passed in accordance to Specified JEDEC and Mil |
| JESD22 | Microchip | Test Method JESD22 B100 and B108 |
| JESD22-A103 | Microchip | Test Method JESD22-A103 |
| JESD22-A104 | Microchip | Test Method JESD22-A104 |
| JESD22-A110 | Microchip | Test Method JESD22-A110 |
| JESD22-A113 | Microchip | Test Method JESD22-A113, JEDEC J-STD-020 |
| JESD22-A118 | Microchip | Test Method JESD22-A118 |
| JESD22B-102 | Microchip | Test Method J-STD-002 / JESD22B-102 |
| MAAN-05PFQZ171 | Microchip | PCN #: MAAN-05PFQZ171 |
| MSL1 | Microchip | Test Condition MSL1: 150⁰C 24 hours Bake, 168 hours Moisture Soak at 85⁰C/85%RH, |
| MSL1 | Microchip | 16L UQFN 4x4x0.5mm (JQX) package at MMT site is qualified for MSL1 at 260⁰C as per |
| MTD6508T-ADJE/JQ | Microchip | wire material for MTD6508-ADJE/JQ and MTD6508T-ADJE/JQ catalog |
| MTD6508T-ADJE/JQ | Microchip | MTD6508T-ADJE/JQ catalog part numbers (CPN) available in |
| MTD6508T-ADJE/JQ | Microchip | Qualification of UGBC1 mask / MTD6508T-ADJE/JQ product / 0.8 mil CuPdAu wire in |
| QMI519 | Microchip | Die Attach Part Number QMI519 |
| R2600043-1 | Microchip | Lot ID R2600043-1 |
| UGBC1 | Microchip | Qualification of UGBC1 mask / MTD6508T-ADJE/JQ product / 0.8 mil CuPdAu wire in |
| UGBC14JQXA00 | Microchip | MP Code (MPC) UGBC14JQXA00 |