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Microchip Qualification Report for MMT Assembly Site (PCN CENO-01UVKE616)

Reliability qualification report for MMT as an additional assembly site for Microchip 24xx and 25xx memory families in 8L DFN-S (6x5x0.9mm) packages.

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Overview

This qualification report details the reliability testing results for Microchip Technology Thailand (MMT) as an additional assembly site for several memory device families, including 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128, 24FC128, and 25CSM01-E/MF. The qualification focuses on the 8L DFN-S (6x5x0.9mm) package using 0.8 mil CuPdAu bond wire and G700LTD mold compound. Testing procedures included MSL1 preconditioning at 260°C, high-temperature storage (175°C for 1000 hours), temperature cycling (2000 cycles), and biased/unbiased HAST. All tests passed according to JEDEC and Q006 Grade 1 standards.

Use Cases

  • Supply chain management and assembly site verification
  • Quality assurance for automotive Grade 1 memory components
  • Technical evaluation of CuPdAu wire bonding in DFN packages
  • Compliance checking for MSL1 moisture sensitivity

Topics

Microchip
PCN CENO-01UVKE616
8L DFN-S
24LC512
24AA512
24FC512
25CSM01-E/MF
MMT assembly site
Q006 Grade 1
CuPdAu bond wire
Reliability Qualification

Referenced Parts

24AA128

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24AA256

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24AA512

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24FC128

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24FC256

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24FC512

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24FC64

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24LC128

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24LC256

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

24LC512

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families

25CSM01-E/MF

Microchip

Part Number (CPN) 25CSM01-E/MF

0Hr

Microchip

Physical Dimension (0Hr)

24AA128

Microchip

24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device

24AA128

Microchip

24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm)

24AA256

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,

24AA256

Microchip

24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,

24AA512

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,

24AA512

Microchip

24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,

24FC128

Microchip

24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device

24FC128

Microchip

24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm)

24FC256

Microchip

24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,

24FC256

Microchip

24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device

24FC512

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,

24FC512

Microchip

Purpose: Qualification of MMT as an additional assembly site for selected 24FC512,

24FC64

Microchip

24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device

24FC64

Microchip

24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,

24LC128

Microchip

24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device

24LC128

Microchip

24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,

24LC256

Microchip

24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,

24LC256

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,

24LC512

Microchip

24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,

24LC512

Microchip

selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,

25CSM01-E/MF

Microchip

Qualification of 66902 mask / 25CSM01-E/MF product / 0.8 mil CuPdAu wire in 8L

5.6V

Microchip

Test Condition +130⁰C / 85%RH / 96 hours / Bias Voltage: 5.6V

5.6V

Microchip

Test Condition +130⁰C / 85%RH / 192 hours / Bias Voltage: 5.6V

669024A6XS00

Microchip

MP Code (MPC) 669024A6XS00

6x5x0.9

Microchip

DFN-S 6x5x0.9 mm package at MMT site is qualified for MSL1 at 260⁰C as per

6x5x0.9

Microchip

PKG width/size 6x5x0.9 mm

6x5x0.9mm

Microchip

24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm)

6x5x0.9mm

Microchip

families available in 8L DFN-S (6x5x0.9mm) package. This is

A194

Microchip

Material A194

B100

Microchip

Test Method JESD22 B100 and B108

B108

Microchip

Test Method JESD22 B100 and B108

BD-003900-01

Microchip

BD Number BD-003900-01

CDF-AEC-Q100-001

Microchip

Test Method CDF-AEC-Q100-001

CENO-01UVKE616

Microchip

PCN #: CENO-01UVKE616

G700LTD

Microchip

MC Part Number G700LTD

J-STD-002

Microchip

Test Method J-STD-002 / JESD22B-102

J-STD-020

Microchip

Test Method JESD22-A113, JEDEC J-STD-020

J-STD-020

Microchip

JEDEC J-STD-020 standard and is passed in accordance to Specified JEDEC and

JESD22

Microchip

Test Method JESD22 B100 and B108

JESD22-A103

Microchip

Test Method JESD22-A103

JESD22-A104

Microchip

Test Method JESD22-A104

JESD22-A110

Microchip

Test Method JESD22-A110

JESD22-A113

Microchip

Test Method JESD22-A113, JEDEC J-STD-020

JESD22-A118

Microchip

Test Method JESD22-A118

JESD22B-102

Microchip

Test Method J-STD-002 / JESD22B-102

MSL1

Microchip

DFN-S 6x5x0.9 mm package at MMT site is qualified for MSL1 at 260⁰C as per

MSL1

Microchip

Test Condition MSL1: 150⁰C 24 hours Bake, 168 hours Moisture Soak at 85⁰C/85%RH,

Q006

Microchip

package. This is a Q006 Grade 1 qualification.

Q006

Microchip

a Q006 Grade 1 qualification.

QMI519

Microchip

Die Attach Part Number QMI519

R2501550-1

Microchip

Lot ID R2501550-1

Microchip Qualification Report for MMT Assembly Site (PCN CENO-01UVKE616) | Design Resources