24AA128
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
Reliability qualification report for MMT as an additional assembly site for Microchip 24xx and 25xx memory families in 8L DFN-S (6x5x0.9mm) packages.
This qualification report details the reliability testing results for Microchip Technology Thailand (MMT) as an additional assembly site for several memory device families, including 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128, 24FC128, and 25CSM01-E/MF. The qualification focuses on the 8L DFN-S (6x5x0.9mm) package using 0.8 mil CuPdAu bond wire and G700LTD mold compound. Testing procedures included MSL1 preconditioning at 260°C, high-temperature storage (175°C for 1000 hours), temperature cycling (2000 cycles), and biased/unbiased HAST. All tests passed according to JEDEC and Q006 Grade 1 standards.
24AA128
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24AA256
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24AA512
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24FC128
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24FC256
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24FC512
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24FC64
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24LC128
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24LC256
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
24LC512
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families
25CSM01-E/MF
Microchip
Part Number (CPN) 25CSM01-E/MF
0Hr
Microchip
Physical Dimension (0Hr)
24AA128
Microchip
24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device
24AA128
Microchip
24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm)
24AA256
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,
24AA256
Microchip
24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,
24AA512
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,
24AA512
Microchip
24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,
24FC128
Microchip
24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device
24FC128
Microchip
24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm)
24FC256
Microchip
24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,
24FC256
Microchip
24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device
24FC512
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,
24FC512
Microchip
Purpose: Qualification of MMT as an additional assembly site for selected 24FC512,
24FC64
Microchip
24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device
24FC64
Microchip
24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,
24LC128
Microchip
24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device
24LC128
Microchip
24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,
24LC256
Microchip
24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,
24LC256
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,
24LC512
Microchip
24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128,
24LC512
Microchip
selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256,
25CSM01-E/MF
Microchip
Qualification of 66902 mask / 25CSM01-E/MF product / 0.8 mil CuPdAu wire in 8L
5.6V
Microchip
Test Condition +130⁰C / 85%RH / 96 hours / Bias Voltage: 5.6V
5.6V
Microchip
Test Condition +130⁰C / 85%RH / 192 hours / Bias Voltage: 5.6V
669024A6XS00
Microchip
MP Code (MPC) 669024A6XS00
6x5x0.9
Microchip
DFN-S 6x5x0.9 mm package at MMT site is qualified for MSL1 at 260⁰C as per
6x5x0.9
Microchip
PKG width/size 6x5x0.9 mm
6x5x0.9mm
Microchip
24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm)
6x5x0.9mm
Microchip
families available in 8L DFN-S (6x5x0.9mm) package. This is
A194
Microchip
Material A194
B100
Microchip
Test Method JESD22 B100 and B108
B108
Microchip
Test Method JESD22 B100 and B108
BD-003900-01
Microchip
BD Number BD-003900-01
CDF-AEC-Q100-001
Microchip
Test Method CDF-AEC-Q100-001
CENO-01UVKE616
Microchip
PCN #: CENO-01UVKE616
G700LTD
Microchip
MC Part Number G700LTD
J-STD-002
Microchip
Test Method J-STD-002 / JESD22B-102
J-STD-020
Microchip
Test Method JESD22-A113, JEDEC J-STD-020
J-STD-020
Microchip
JEDEC J-STD-020 standard and is passed in accordance to Specified JEDEC and
JESD22
Microchip
Test Method JESD22 B100 and B108
JESD22-A103
Microchip
Test Method JESD22-A103
JESD22-A104
Microchip
Test Method JESD22-A104
JESD22-A110
Microchip
Test Method JESD22-A110
JESD22-A113
Microchip
Test Method JESD22-A113, JEDEC J-STD-020
JESD22-A118
Microchip
Test Method JESD22-A118
JESD22B-102
Microchip
Test Method J-STD-002 / JESD22B-102
MSL1
Microchip
DFN-S 6x5x0.9 mm package at MMT site is qualified for MSL1 at 260⁰C as per
MSL1
Microchip
Test Condition MSL1: 150⁰C 24 hours Bake, 168 hours Moisture Soak at 85⁰C/85%RH,
Q006
Microchip
package. This is a Q006 Grade 1 qualification.
Q006
Microchip
a Q006 Grade 1 qualification.
QMI519
Microchip
Die Attach Part Number QMI519
R2501550-1
Microchip
Lot ID R2501550-1
| 24AA128 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24AA256 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24AA512 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24FC128 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24FC256 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24FC512 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24FC64 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24LC128 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24LC256 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 24LC512 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device families |
| 25CSM01-E/MF | Microchip | Part Number (CPN) 25CSM01-E/MF |
| 0Hr | Microchip | Physical Dimension (0Hr) |
| 24AA128 | Microchip | 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device |
| 24AA128 | Microchip | 24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm) |
| 24AA256 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, |
| 24AA256 | Microchip | 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, |
| 24AA512 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, |
| 24AA512 | Microchip | 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, |
| 24FC128 | Microchip | 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device |
| 24FC128 | Microchip | 24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm) |
| 24FC256 | Microchip | 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, |
| 24FC256 | Microchip | 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device |
| 24FC512 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, |
| 24FC512 | Microchip | Purpose: Qualification of MMT as an additional assembly site for selected 24FC512, |
| 24FC64 | Microchip | 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device |
| 24FC64 | Microchip | 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, |
| 24LC128 | Microchip | 24FC256, 24FC64, 24LC128, 24AA128 and 24FC128 device |
| 24LC128 | Microchip | 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, |
| 24LC256 | Microchip | 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, |
| 24LC256 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, |
| 24LC512 | Microchip | 24LC512, 24AA512, 24LC256, 24AA256, 24FC256, 24FC64, 24LC128, |
| 24LC512 | Microchip | selected 24FC512, 24LC512, 24AA512, 24LC256, 24AA256, |
| 25CSM01-E/MF | Microchip | Qualification of 66902 mask / 25CSM01-E/MF product / 0.8 mil CuPdAu wire in 8L |
| 5.6V | Microchip | Test Condition +130⁰C / 85%RH / 96 hours / Bias Voltage: 5.6V |
| 5.6V | Microchip | Test Condition +130⁰C / 85%RH / 192 hours / Bias Voltage: 5.6V |
| 669024A6XS00 | Microchip | MP Code (MPC) 669024A6XS00 |
| 6x5x0.9 | Microchip | DFN-S 6x5x0.9 mm package at MMT site is qualified for MSL1 at 260⁰C as per |
| 6x5x0.9 | Microchip | PKG width/size 6x5x0.9 mm |
| 6x5x0.9mm | Microchip | 24AA128 and 24FC128 device families available in 8L DFN-S (6x5x0.9mm) |
| 6x5x0.9mm | Microchip | families available in 8L DFN-S (6x5x0.9mm) package. This is |
| A194 | Microchip | Material A194 |
| B100 | Microchip | Test Method JESD22 B100 and B108 |
| B108 | Microchip | Test Method JESD22 B100 and B108 |
| BD-003900-01 | Microchip | BD Number BD-003900-01 |
| CDF-AEC-Q100-001 | Microchip | Test Method CDF-AEC-Q100-001 |
| CENO-01UVKE616 | Microchip | PCN #: CENO-01UVKE616 |
| G700LTD | Microchip | MC Part Number G700LTD |
| J-STD-002 | Microchip | Test Method J-STD-002 / JESD22B-102 |
| J-STD-020 | Microchip | Test Method JESD22-A113, JEDEC J-STD-020 |
| J-STD-020 | Microchip | JEDEC J-STD-020 standard and is passed in accordance to Specified JEDEC and |
| JESD22 | Microchip | Test Method JESD22 B100 and B108 |
| JESD22-A103 | Microchip | Test Method JESD22-A103 |
| JESD22-A104 | Microchip | Test Method JESD22-A104 |
| JESD22-A110 | Microchip | Test Method JESD22-A110 |
| JESD22-A113 | Microchip | Test Method JESD22-A113, JEDEC J-STD-020 |
| JESD22-A118 | Microchip | Test Method JESD22-A118 |
| JESD22B-102 | Microchip | Test Method J-STD-002 / JESD22B-102 |
| MSL1 | Microchip | DFN-S 6x5x0.9 mm package at MMT site is qualified for MSL1 at 260⁰C as per |
| MSL1 | Microchip | Test Condition MSL1: 150⁰C 24 hours Bake, 168 hours Moisture Soak at 85⁰C/85%RH, |
| Q006 | Microchip | package. This is a Q006 Grade 1 qualification. |
| Q006 | Microchip | a Q006 Grade 1 qualification. |
| QMI519 | Microchip | Die Attach Part Number QMI519 |
| R2501550-1 | Microchip | Lot ID R2501550-1 |