PIC16F17556-E/SP
Microchip
PIC16F17556-E/SP Tube 15
Product Change NoticeMicrochip
PCN CAAN-03PGUD950: Qualification Plan for CuPdAu Bond Wire in Microchip AVR and PIC 28L SPDIP Packages
Qualification plan for palladium coated copper with gold flash (CuPdAu) bond wire for Microchip AVR and PIC microcontrollers in 28-lead SPDIP packages.
Overview
This qualification plan (PCN CAAN-03PGUD950) details the addition of palladium coated copper with gold flash (CuPdAu) as a bond wire material for selected Microchip microcontroller families. The change affects AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x, and PIC16F1815x devices in 28-lead SPDIP packages assembled at the MMT site. Reliability testing includes Solderability (J-STD-002E), High Temperature Storage Life (HTSL), HAST, and Temperature Cycling to meet AEC-Q100 Grade 0 requirements.
Use Cases
- Manufacturing process verification
- Supply chain component tracking
- Quality assurance documentation
- Hardware reliability assessment
Topics
Microchip
PCN
AVR16EA28
PIC16F17556-E/SP
CuPdAu
bond wire
SPDIP
AEC-Q100
28L SPDIP
reliability qualification
Referenced Parts
120x120
Microchip
120x120 mils
1st
Microchip
1st Readpoint:
28L
Microchip
PIC16F1815x device families available in 28L SPDIP (.300in) package at MMT
28L
Microchip
families available in 28L SPDIP (.300in) package at MMT assembly
A101
Microchip
uHAST JESD22-A102, A118, or A101
A110
Microchip
HAST JESD22-A101 or A110
A118
Microchip
uHAST JESD22-A102, A118, or A101
AEC-Q006.
Microchip
Grade 0: +25°C, +85°C, +125°C, +150°C 77 5 3 246 0 10 - 22 MTAI MTAI Perform per the requirements in AEC-Q006.
AEC-Q006.
Microchip
Grade 0: +25°C,+85°C, +125°C, +150°C 77 5 3 246 0 15 - 120 MTAI MTAI Perform per the requirements in AEC-Q006.
AEC-Q100/Q101.
Microchip
Grade 0: +25°C, +85°C, +125°C, +150°C 45 5 3 150 0 21 - 167 MTAI MTAI Perform per the requirements in AEC-Q100/Q101.
AVR16EA28
Microchip
as an additional bond wire material for selected AVR16EA28,
AVR16EA28
Microchip
bond wire material for selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28,
AVR16EB28
Microchip
bond wire material for selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28,
AVR16EB28
Microchip
AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x,
AVR32EA28
Microchip
AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x,
AVR32EA28
Microchip
bond wire material for selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28,
AVR32EB28
Microchip
bond wire material for selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28,
AVR32EB28
Microchip
AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x,
AVR64EA28
Microchip
AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x,
AVR64EA28
Microchip
AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and
BD-004349
Microchip
BD-004349 Rev. 01
CAAN-03PGUD950
Microchip
PCN#: CAAN-03PGUD950
CDF-AEC-Q100-001
Microchip
CDF-AEC-Q100-001 5 0 1 5 0 5 MMT 30 bonds from a min. 5 devices.
GE800
Microchip
MC GE800
J-STD-002E
Microchip
J-STD-002E ; Perform 8 hours of steam aging for Matte tin finish and 1
JESD22-A101
Microchip
HAST JESD22-A101 or A110
JESD22-A102
Microchip
uHAST JESD22-A102, A118, or A101
JESD22-A104
Microchip
Temp Cycle JESD22-A104 and Appendix 3
PIC16F1525x
Microchip
AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and
PIC16F1525x
Microchip
AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x,
PIC16F1715x
Microchip
PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device
PIC16F1715x
Microchip
AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and
PIC16F1755x
Microchip
PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device
PIC16F1755x
Microchip
AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and
PIC16F1805x
Microchip
PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device
PIC16F1805x
Microchip
AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and
PIC16F1815x
Microchip
PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device
PIC16F1815x
Microchip
PIC16F1815x device families available in 28L SPDIP (.300in) package at MMT
AVR16EA28
Microchip
selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x
AVR16EB28
Microchip
selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x
AVR32EA28
Microchip
selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x
AVR32EB28
Microchip
selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x
AVR64EA28
Microchip
selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x
PIC16F1525x
Microchip
PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families
PIC16F1715x
Microchip
PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families
PIC16F1755x
Microchip
PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families
PIC16F1805x
Microchip
PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families
PIC16F1815x
Microchip
PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families
| PIC16F17556-E/SP | Microchip | PIC16F17556-E/SP Tube 15 |
| 120x120 | Microchip | 120x120 mils |
| 1st | Microchip | 1st Readpoint: |
| 28L | Microchip | PIC16F1815x device families available in 28L SPDIP (.300in) package at MMT |
| 28L | Microchip | families available in 28L SPDIP (.300in) package at MMT assembly |
| A101 | Microchip | uHAST JESD22-A102, A118, or A101 |
| A110 | Microchip | HAST JESD22-A101 or A110 |
| A118 | Microchip | uHAST JESD22-A102, A118, or A101 |
| AEC-Q006. | Microchip | Grade 0: +25°C, +85°C, +125°C, +150°C 77 5 3 246 0 10 - 22 MTAI MTAI Perform per the requirements in AEC-Q006. |
| AEC-Q006. | Microchip | Grade 0: +25°C,+85°C, +125°C, +150°C 77 5 3 246 0 15 - 120 MTAI MTAI Perform per the requirements in AEC-Q006. |
| AEC-Q100/Q101. | Microchip | Grade 0: +25°C, +85°C, +125°C, +150°C 45 5 3 150 0 21 - 167 MTAI MTAI Perform per the requirements in AEC-Q100/Q101. |
| AVR16EA28 | Microchip | as an additional bond wire material for selected AVR16EA28, |
| AVR16EA28 | Microchip | bond wire material for selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, |
| AVR16EB28 | Microchip | bond wire material for selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, |
| AVR16EB28 | Microchip | AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x, |
| AVR32EA28 | Microchip | AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x, |
| AVR32EA28 | Microchip | bond wire material for selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, |
| AVR32EB28 | Microchip | bond wire material for selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, |
| AVR32EB28 | Microchip | AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x, |
| AVR64EA28 | Microchip | AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x, |
| AVR64EA28 | Microchip | AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and |
| BD-004349 | Microchip | BD-004349 Rev. 01 |
| CAAN-03PGUD950 | Microchip | PCN#: CAAN-03PGUD950 |
| CDF-AEC-Q100-001 | Microchip | CDF-AEC-Q100-001 5 0 1 5 0 5 MMT 30 bonds from a min. 5 devices. |
| GE800 | Microchip | MC GE800 |
| J-STD-002E | Microchip | J-STD-002E ; Perform 8 hours of steam aging for Matte tin finish and 1 |
| JESD22-A101 | Microchip | HAST JESD22-A101 or A110 |
| JESD22-A102 | Microchip | uHAST JESD22-A102, A118, or A101 |
| JESD22-A104 | Microchip | Temp Cycle JESD22-A104 and Appendix 3 |
| PIC16F1525x | Microchip | AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and |
| PIC16F1525x | Microchip | AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x, |
| PIC16F1715x | Microchip | PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device |
| PIC16F1715x | Microchip | AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and |
| PIC16F1755x | Microchip | PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device |
| PIC16F1755x | Microchip | AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and |
| PIC16F1805x | Microchip | PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device |
| PIC16F1805x | Microchip | AVR64EA28, PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and |
| PIC16F1815x | Microchip | PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device |
| PIC16F1815x | Microchip | PIC16F1815x device families available in 28L SPDIP (.300in) package at MMT |
| AVR16EA28 | Microchip | selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x |
| AVR16EB28 | Microchip | selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x |
| AVR32EA28 | Microchip | selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x |
| AVR32EB28 | Microchip | selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x |
| AVR64EA28 | Microchip | selected AVR16EA28, AVR16EB28, AVR32EA28, AVR32EB28, AVR64EA28, PIC16F1525x |
| PIC16F1525x | Microchip | PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families |
| PIC16F1715x | Microchip | PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families |
| PIC16F1755x | Microchip | PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families |
| PIC16F1805x | Microchip | PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families |
| PIC16F1815x | Microchip | PIC16F1525x, PIC16F1715x, PIC16F1755x, PIC16F1805x and PIC16F1815x device families |