MIC23250-S4YMT
Microchip
Device MIC23250-S4YMT in in 10L UDFN COL assembled at UNIS with 1.3 mil Au wire is selected as the qualification vehicle.
Product Change NoticeMicrochip
Qualification Report: Fabrication Site Transfer to Fab 5 (MCSO) for Selected MICxxxx Families
Qualification report confirming Microchip Technology Colorado - Fab 5 (MCSO) as a new fabrication location for selected MIC18xx through MIC94xx device families.
Overview
This qualification report details the transition of the CSI05 fabrication process to Microchip Technology Colorado – Fab 5 (MCSO) for various integrated circuit families. Using the MIC23250-S4YMT as the primary qualification vehicle, the report documents successful reliability testing including High Temperature Operating Life (HTOL), ESD (HBM and CDM), and Latch Up. The study concludes that the performance and reliability of devices produced at Fab 5 are comparable to those from the previous Fab 2 location. Affected product lines include MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx, and MIC94xx, with several specific models qualifying by similarity (QBS).
Use Cases
- Supply chain risk assessment and site qualification
- Quality assurance verification for Microchip power management ICs
- Regulatory and compliance documentation for manufacturing site changes
- Procurement verification for MICxxxx series components
Topics
Microchip
Qualification Report
Fab 5
MCSO
MIC23250-S4YMT
CSI05 Process
Fabrication Site Change
PCN
Reliability Testing
HTOL
ESD
HAST
Referenced Parts
MIC23250-S4YMT
Microchip
Based on successful Reliability stress results on test device MIC23250-S4YMT and the fact that ESD
MIC23250-S4YMT
Microchip
Requirements”. Device MIC23250-S4YMT in in 10L UDFN COL assembled at UNIS with 1.3 mil Au
0.5kV
Microchip
Highest Passing Level +/-0.5kV +/-0.5kV +/-0.5kV +/- 0.5kV Pass
0.5kV.
Microchip
Note on ESD-HBM: ESD level of this product in Fab 5 is identical to Fab 2. Both pass up to 0.5kV. For the ESD HBM
10-lead
Microchip
PACKAGE 10-lead UDFN2mmx2mm 10-lead UDFN2mmx2mm 10-lead UDFN2mmx2mm
10L
Microchip
Pin/Ball Count 10L
10L
Microchip
Requirements”. Device MIC23250-S4YMT in in 10L UDFN COL assembled at UNIS with 1.3 mil Au
125C
Microchip
Test Method/Condition Ta = 125C, 1000 hrs, VIN = 5.5V
22601YJ4AA07
Microchip
MP Code (MPC) 22601YJ4AA07
22K
Microchip
MIC94060 and MIC9409x device families of 22K technology available in
22K
Microchip
and MIC9409x device families of 22K technology available in various
260oC
Microchip
+85oC/85%RH/168hrs, 3x at 260oC peak Reflow Temperature
2kV
Microchip
Highest Passing Level +/- 2kV +/- 2kV +/- 2kV Pass
2x2x0.6
Microchip
PKG width/size 2x2x0.6 mm
5.5V
Microchip
Test Method/Condition Ta = 125C, 1000 hrs, VIN = 5.5V
8006NS
Microchip
Part Number 8006NS
96hrs.
Microchip
Method/Condition JESD22-A118, Ta = +130oC/85%RH, 96hrs.
A194
Microchip
Material A194
CSI05
Microchip
HBM, CDM and LU levels of Fab 5 material are comparable to those fabricated in Fab 2, CSI05
CSI05
Microchip
wire is selected as the qualification vehicle. CSI05 process is currently fabricated at Fab 2 (Tempe).
CSI05
Microchip
The purpose of this qualification is to release the CSI05 process fabricated at Fab 5 (Colorado Spring)
D-003999
Microchip
BD Number D-003999
G770HCD
Microchip
MC Part Number G770HCD
J-STD-020
Microchip
Test Method/Condition JEDEC J-STD-020 and JESD22-A113, MSL Level 1 soak at
JESD22-A103
Microchip
Test Method/Condition JESD22-A103, Ta = +175 oC, 500 hrs
JESD22-A104
Microchip
Test Method/Condition JESD22-A104, Ta = -65oC/+150 oC, 500 cycles.
JESD22-A110
Microchip
JESD22-A110, VIn = +5.5V, Ta = +130oC/85%RH, 96 hrs
JESD22-A113
Microchip
Test Method/Condition JEDEC J-STD-020 and JESD22-A113, MSL Level 1 soak at
JESD22-A118
Microchip
Method/Condition JESD22-A118, Ta = +130oC/85%RH, 96hrs.
JESD78C1
Microchip
Test Method JESD78C1
JS-001-2012
Microchip
Test Method/Condition JS-001-2012
JS-002-2014
Microchip
Test Method/Condition JS-002-2014
MAAN-04KQZT866
Microchip
PCN#: MAAN-04KQZT866
MCSO525376352.210/B4D1521
Microchip
WAFER LOT MCSO525376352.210/B4D1521 MCSO525447112.222/D5A0438 MCSO525396512.112/B4D1602
MCSO525376352.220/B4D1521
Microchip
WAFER LOT MCSO525376352.220/B4D1521 MCSO525447112.220/D5A0438 MCSO525396512.113/B4D1602
MCSO525396512.112/B4D1602
Microchip
WAFER LOT MCSO525376352.210/B4D1521 MCSO525447112.222/D5A0438 MCSO525396512.112/B4D1602
MCSO525396512.113/B4D1602
Microchip
WAFER LOT MCSO525376352.220/B4D1521 MCSO525447112.220/D5A0438 MCSO525396512.113/B4D1602
MCSO525447112.220/D5A0438
Microchip
WAFER LOT MCSO525376352.220/B4D1521 MCSO525447112.220/D5A0438 MCSO525396512.113/B4D1602
MCSO525447112.222/D5A0438
Microchip
WAFER LOT MCSO525376352.210/B4D1521 MCSO525447112.222/D5A0438 MCSO525396512.112/B4D1602
MIC18xx
Microchip
fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx,
MIC18xx
Microchip
new fabrication location for selected MIC18xx, MIC20xx, MIC23xx,
MIC2005
Microchip
various packages. The selected MIC2005, MIC22400, MIC22600,
MIC20xx
Microchip
fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx,
MIC20xx
Microchip
new fabrication location for selected MIC18xx, MIC20xx, MIC23xx,
MIC22400
Microchip
various packages. The selected MIC2005, MIC22400, MIC22600,
MIC22600
Microchip
various packages. The selected MIC2005, MIC22400, MIC22600,
MIC2315x
Microchip
MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x,
MIC23xx
Microchip
fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx,
MIC23xx
Microchip
new fabrication location for selected MIC18xx, MIC20xx, MIC23xx,
MIC27xx
Microchip
MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC27xx
Microchip
fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx,
MIC2800
Microchip
MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x,
MIC2810
Microchip
MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x,
MIC28xx
Microchip
MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC28xx
Microchip
MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC33xx
Microchip
MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC33xx
Microchip
MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC4722
Microchip
MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x,
MIC47xx
Microchip
MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC47xx
Microchip
MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC51xx
Microchip
MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC51xx
Microchip
MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC530x
Microchip
MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x,
MIC5310
Microchip
MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x,
MIC533x
Microchip
MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x,
MIC535x
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053,
MIC535x
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060
MIC536x
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060
MIC536x
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053,
MIC537x
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060
MIC537x
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053,
MIC538x
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060
MIC538x
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053,
MIC53xx
Microchip
MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC53xx
Microchip
MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC63xx
Microchip
MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC63xx
Microchip
MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx,
MIC80xx
Microchip
MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in
MIC81xx
Microchip
MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in
MIC82xx
Microchip
MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in
MIC94052
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053,
MIC94052
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060
MIC94053
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060
MIC94053
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053,
MIC94060
Microchip
MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060
MIC94060
Microchip
MIC94060 and MIC9409x device families of 22K technology available in
MIC9409x
Microchip
and MIC9409x device families of 22K technology available in various
MIC9409x
Microchip
MIC94060 and MIC9409x device families of 22K technology available in
MIC94xx
Microchip
MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in
ML0720251148.
Microchip
performance of Fab 2 material, please refer to ML0720251148.
ML0720258469
Microchip
Document Control Number ML0720258469
MSL-1
Microchip
MSL information MSL-1
MSL1
Microchip
b. HAST Post MSL1 Preconditioning.
MSL1
Microchip
c. Unbiased HAST post MSL1 Preconditioning.
MSL1
Microchip
d. Temperature Cycling post MSL1 Preconditioning
UDFN2mmx2mm
Microchip
PACKAGE 10-lead UDFN2mmx2mm 10-lead UDFN2mmx2mm 10-lead UDFN2mmx2mm
UNIS254400021.000
Microchip
LOT UNIS254400021.000 UNIS260500035.000 UNIS260500036.000
UNIS254900019.000
Microchip
LOT UNIS254900019.000 UNIS260600001.000 UNIS260600002.000
UNIS260500035.000
Microchip
LOT UNIS254400021.000 UNIS260500035.000 UNIS260500036.000
UNIS260500036.000
Microchip
LOT UNIS254400021.000 UNIS260500035.000 UNIS260500036.000
UNIS260600001.000
Microchip
LOT UNIS254900019.000 UNIS260600001.000 UNIS260600002.000
UNIS260600002.000
Microchip
LOT UNIS254900019.000 UNIS260600001.000 UNIS260600002.000
MIC2005
Microchip
The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families
MIC22400
Microchip
The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families
MIC22600
Microchip
The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families
MIC2800
Microchip
The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families
MIC2810
Microchip
The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families
MIC4722
Microchip
The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families
MIC5310
Microchip
The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310... device families
MIC94052
Microchip
MIC94052, MIC94053, MIC94060 and MIC9409x device families
MIC94053
Microchip
MIC94052, MIC94053, MIC94060 and MIC9409x device families
MIC94060
Microchip
MIC94052, MIC94053, MIC94060 and MIC9409x device families
| MIC23250-S4YMT | Microchip | Device MIC23250-S4YMT in in 10L UDFN COL assembled at UNIS with 1.3 mil Au wire is selected as the qualification vehicle. |
| MIC23250-S4YMT | Microchip | Part Number (CPN) MIC23250-S4YMT |
| MIC23250-S4YMT | Microchip | Device MIC23250-S4YMT |
| MIC23250-S4YMT | Microchip | Based on successful Reliability stress results on test device MIC23250-S4YMT and the fact that ESD |
| MIC23250-S4YMT | Microchip | Requirements”. Device MIC23250-S4YMT in in 10L UDFN COL assembled at UNIS with 1.3 mil Au |
| 0.5kV | Microchip | Highest Passing Level +/-0.5kV +/-0.5kV +/-0.5kV +/- 0.5kV Pass |
| 0.5kV. | Microchip | Note on ESD-HBM: ESD level of this product in Fab 5 is identical to Fab 2. Both pass up to 0.5kV. For the ESD HBM |
| 10-lead | Microchip | PACKAGE 10-lead UDFN2mmx2mm 10-lead UDFN2mmx2mm 10-lead UDFN2mmx2mm |
| 10L | Microchip | Pin/Ball Count 10L |
| 10L | Microchip | Requirements”. Device MIC23250-S4YMT in in 10L UDFN COL assembled at UNIS with 1.3 mil Au |
| 125C | Microchip | Test Method/Condition Ta = 125C, 1000 hrs, VIN = 5.5V |
| 22601YJ4AA07 | Microchip | MP Code (MPC) 22601YJ4AA07 |
| 22K | Microchip | MIC94060 and MIC9409x device families of 22K technology available in |
| 22K | Microchip | and MIC9409x device families of 22K technology available in various |
| 260oC | Microchip | +85oC/85%RH/168hrs, 3x at 260oC peak Reflow Temperature |
| 2kV | Microchip | Highest Passing Level +/- 2kV +/- 2kV +/- 2kV Pass |
| 2x2x0.6 | Microchip | PKG width/size 2x2x0.6 mm |
| 5.5V | Microchip | Test Method/Condition Ta = 125C, 1000 hrs, VIN = 5.5V |
| 8006NS | Microchip | Part Number 8006NS |
| 96hrs. | Microchip | Method/Condition JESD22-A118, Ta = +130oC/85%RH, 96hrs. |
| A194 | Microchip | Material A194 |
| CSI05 | Microchip | HBM, CDM and LU levels of Fab 5 material are comparable to those fabricated in Fab 2, CSI05 |
| CSI05 | Microchip | wire is selected as the qualification vehicle. CSI05 process is currently fabricated at Fab 2 (Tempe). |
| CSI05 | Microchip | The purpose of this qualification is to release the CSI05 process fabricated at Fab 5 (Colorado Spring) |
| D-003999 | Microchip | BD Number D-003999 |
| G770HCD | Microchip | MC Part Number G770HCD |
| J-STD-020 | Microchip | Test Method/Condition JEDEC J-STD-020 and JESD22-A113, MSL Level 1 soak at |
| JESD22-A103 | Microchip | Test Method/Condition JESD22-A103, Ta = +175 oC, 500 hrs |
| JESD22-A104 | Microchip | Test Method/Condition JESD22-A104, Ta = -65oC/+150 oC, 500 cycles. |
| JESD22-A110 | Microchip | JESD22-A110, VIn = +5.5V, Ta = +130oC/85%RH, 96 hrs |
| JESD22-A113 | Microchip | Test Method/Condition JEDEC J-STD-020 and JESD22-A113, MSL Level 1 soak at |
| JESD22-A118 | Microchip | Method/Condition JESD22-A118, Ta = +130oC/85%RH, 96hrs. |
| JESD78C1 | Microchip | Test Method JESD78C1 |
| JS-001-2012 | Microchip | Test Method/Condition JS-001-2012 |
| JS-002-2014 | Microchip | Test Method/Condition JS-002-2014 |
| MAAN-04KQZT866 | Microchip | PCN#: MAAN-04KQZT866 |
| MCSO525376352.210/B4D1521 | Microchip | WAFER LOT MCSO525376352.210/B4D1521 MCSO525447112.222/D5A0438 MCSO525396512.112/B4D1602 |
| MCSO525376352.220/B4D1521 | Microchip | WAFER LOT MCSO525376352.220/B4D1521 MCSO525447112.220/D5A0438 MCSO525396512.113/B4D1602 |
| MCSO525396512.112/B4D1602 | Microchip | WAFER LOT MCSO525376352.210/B4D1521 MCSO525447112.222/D5A0438 MCSO525396512.112/B4D1602 |
| MCSO525396512.113/B4D1602 | Microchip | WAFER LOT MCSO525376352.220/B4D1521 MCSO525447112.220/D5A0438 MCSO525396512.113/B4D1602 |
| MCSO525447112.220/D5A0438 | Microchip | WAFER LOT MCSO525376352.220/B4D1521 MCSO525447112.220/D5A0438 MCSO525396512.113/B4D1602 |
| MCSO525447112.222/D5A0438 | Microchip | WAFER LOT MCSO525376352.210/B4D1521 MCSO525447112.222/D5A0438 MCSO525396512.112/B4D1602 |
| MIC18xx | Microchip | fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, |
| MIC18xx | Microchip | new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, |
| MIC2005 | Microchip | various packages. The selected MIC2005, MIC22400, MIC22600, |
| MIC20xx | Microchip | fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, |
| MIC20xx | Microchip | new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, |
| MIC22400 | Microchip | various packages. The selected MIC2005, MIC22400, MIC22600, |
| MIC22600 | Microchip | various packages. The selected MIC2005, MIC22400, MIC22600, |
| MIC2315x | Microchip | MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x, |
| MIC23xx | Microchip | fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, |
| MIC23xx | Microchip | new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, |
| MIC27xx | Microchip | MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC27xx | Microchip | fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, |
| MIC2800 | Microchip | MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x, |
| MIC2810 | Microchip | MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x, |
| MIC28xx | Microchip | MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC28xx | Microchip | MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC33xx | Microchip | MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC33xx | Microchip | MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC4722 | Microchip | MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x, |
| MIC47xx | Microchip | MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC47xx | Microchip | MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC51xx | Microchip | MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC51xx | Microchip | MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC530x | Microchip | MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x, |
| MIC5310 | Microchip | MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x, |
| MIC533x | Microchip | MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310, MIC533x, |
| MIC535x | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, |
| MIC535x | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060 |
| MIC536x | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060 |
| MIC536x | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, |
| MIC537x | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060 |
| MIC537x | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, |
| MIC538x | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060 |
| MIC538x | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, |
| MIC53xx | Microchip | MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC53xx | Microchip | MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC63xx | Microchip | MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC63xx | Microchip | MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, |
| MIC80xx | Microchip | MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in |
| MIC81xx | Microchip | MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in |
| MIC82xx | Microchip | MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in |
| MIC94052 | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, |
| MIC94052 | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060 |
| MIC94053 | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060 |
| MIC94053 | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, |
| MIC94060 | Microchip | MIC535x, MIC536x, MIC537x, MIC538x, MIC94052, MIC94053, MIC94060 |
| MIC94060 | Microchip | MIC94060 and MIC9409x device families of 22K technology available in |
| MIC9409x | Microchip | and MIC9409x device families of 22K technology available in various |
| MIC9409x | Microchip | MIC94060 and MIC9409x device families of 22K technology available in |
| MIC94xx | Microchip | MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in |
| ML0720251148. | Microchip | performance of Fab 2 material, please refer to ML0720251148. |
| ML0720258469 | Microchip | Document Control Number ML0720258469 |
| MSL-1 | Microchip | MSL information MSL-1 |
| MSL1 | Microchip | b. HAST Post MSL1 Preconditioning. |
| MSL1 | Microchip | c. Unbiased HAST post MSL1 Preconditioning. |
| MSL1 | Microchip | d. Temperature Cycling post MSL1 Preconditioning |
| UDFN2mmx2mm | Microchip | PACKAGE 10-lead UDFN2mmx2mm 10-lead UDFN2mmx2mm 10-lead UDFN2mmx2mm |
| UNIS254400021.000 | Microchip | LOT UNIS254400021.000 UNIS260500035.000 UNIS260500036.000 |
| UNIS254900019.000 | Microchip | LOT UNIS254900019.000 UNIS260600001.000 UNIS260600002.000 |
| UNIS260500035.000 | Microchip | LOT UNIS254400021.000 UNIS260500035.000 UNIS260500036.000 |
| UNIS260500036.000 | Microchip | LOT UNIS254400021.000 UNIS260500035.000 UNIS260500036.000 |
| UNIS260600001.000 | Microchip | LOT UNIS254900019.000 UNIS260600001.000 UNIS260600002.000 |
| UNIS260600002.000 | Microchip | LOT UNIS254900019.000 UNIS260600001.000 UNIS260600002.000 |
| MIC2005 | Microchip | The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families |
| MIC22400 | Microchip | The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families |
| MIC22600 | Microchip | The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families |
| MIC2800 | Microchip | The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families |
| MIC2810 | Microchip | The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families |
| MIC4722 | Microchip | The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722... device families |
| MIC5310 | Microchip | The selected MIC2005, MIC22400, MIC22600, MIC2315x, MIC2800, MIC2810, MIC4722, MIC530x, MIC5310... device families |
| MIC94052 | Microchip | MIC94052, MIC94053, MIC94060 and MIC9409x device families |
| MIC94053 | Microchip | MIC94052, MIC94053, MIC94060 and MIC9409x device families |
| MIC94060 | Microchip | MIC94052, MIC94053, MIC94060 and MIC9409x device families |