Qualification Report for Microchip Fab 4 (GRTM) Fabrication Location Expansion
Reliability qualification report for Microchip Gresham Fab 4 (GRTM) as a new fabrication location for HCS370, MCP2150, MCP2155, and PIC16F device families.
Overview
This qualification report summarizes the reliability testing performed to approve Microchip Technology's Gresham – Fab 4 (GRTM) as an additional fabrication site. The report covers multiple device families, including HCS370, MCP2150, MCP2155, and several PIC16F microcontrollers (PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876, and PIC16F877). Evaluation was conducted according to Q006 Grade 1 standards, featuring Early Life Failure Rate (ELFR), High Temperature Operational Life (HTOL), ESD testing (HBM, CDM, and Latch-up), and environmental stress tests such as HAST and Temperature Cycling. All test lots passed, leading to the successful production release of the 120K Flash process at the Gresham facility.
Referenced Parts
Microchip
PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various
Microchip
PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various
Microchip
PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various
MCP2150
Microchip
new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627
MCP2155
Microchip
new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627
PIC16F627
Microchip
PIC16F627, PIC16F628, PIC16F84A, PIC16F870
PIC16F628
Microchip
PIC16F627, PIC16F628, PIC16F84A, PIC16F870
PIC16F84A
Microchip
PIC16F627, PIC16F628, PIC16F84A, PIC16F870
PIC16F870
Microchip
PIC16F870, PIC16F871, PIC16F872, PIC16F873
PIC16F871
Microchip
PIC16F870, PIC16F871, PIC16F872, PIC16F873
PIC16F872
Microchip
PIC16F870, PIC16F871, PIC16F872, PIC16F873
PIC16F873
Microchip
PIC16F870, PIC16F871, PIC16F872, PIC16F873
PIC16LF872
Microchip
Part No. PIC16F872/PIC16LF872
105mA
Microchip
12/Lot 1 6 Pass @ +25°C, 105mA Pulse
105mA
Microchip
6 Pass @ +125°C, 105mA Pulse
12/Lot
Microchip
12/Lot 1 6 Pass @ +25°C, 105mA Pulse
12/Lot
Microchip
12/Lot 1 ± 3000V (Passed)
120K
Microchip
for qualification testing. This qualification will release the 120K Flash, device family process to production.
125oC
Microchip
Test Condition 125oC / 1008 hours
125oC
Microchip
Test Condition 125oC / 48 hours
150oC
Microchip
Test Condition 150oC / 1008 hours
18/Lot
Microchip
18/Lot 1 ± 2000V corner pins (Passed)
2000V
Microchip
18/Lot 1 ± 2000V corner pins (Passed)
2200D
Microchip
System: ERSA RA 2200D
2526BPV
Microchip
MTAI261301779.000 GRSM425511355.310 2526BPV
2526C36
Microchip
MTAI261301915.000 GRSM425511355.310 2526C36
2526C3C
Microchip
MTAI261301921.000 GRSM425511355.310 2526C3C
28L
Microchip
28L SOIC (.300in) assembled by MTAI pass reliability test per QCI-39000.This
28L
Microchip
28L SOIC
3000V
Microchip
12/Lot 1 ± 3000V (Passed)
6000X
Microchip
System: HAST 6000X
95.5Ag3.9
Microchip
Solder material: Pb Free Sn 95.5Ag3.9
A-066093
Microchip
A-066093 Rev A -Temp BD
AEC-Q100-002
Microchip
ESD – HBM AEC-Q100-002
AEC-Q100-004
Microchip
ESD – LU AEC-Q100-004
AEC-Q100-011
Microchip
ESD – CDM AEC-Q100-011
DSNO-17TVWI575
Microchip
PCN #: DSNO-17TVWI575
GRSM425511355.300
Microchip
LOT GRSM425511355.300 GRSM426042763.210 GRSM426202783.100
GRSM425511355.310
Microchip
MTAI261301779.000 GRSM425511355.310 2526BPV
GRSM425511355.310
Microchip
MTAI261301915.000 GRSM425511355.310 2526C36
GRSM425511355.310
Microchip
MTAI261301921.000 GRSM425511355.310 2526C3C
GRSM426042763.210
Microchip
LOT GRSM425511355.300 GRSM426042763.210 GRSM426202783.100
GRSM426202783.100
Microchip
LOT GRSM425511355.300 GRSM426042763.210 GRSM426202783.100
HCS370
Microchip
fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627,
HCS370
Microchip
HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871,
HCS370
Microchip
location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A,
J-STD-020E
Microchip
temperature per IPC/JEDEC J-STD-020E standard.
J-STD-020E
Microchip
(IPC/JEDEC J-STD-020E)
J750
Microchip
System: J750 231(0) 0/231 Pass 77 units / lot
J750
Microchip
System: J750
J750
Microchip
System: J750 231(0) 0/231 Pass
J750
Microchip
System: J750 135(0) 0/135 Pass
JESD22-A103
Microchip
Test Method AEC Q100-005 | JESD22-A103
JESD22-A108
Microchip
Test Method AEC Q100-005 | JESD22-A108
MCP2150
Microchip
HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871,
MCP2150
Microchip
location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A,
MCP2150
Microchip
fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627,
MCP2155
Microchip
fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627,
MCP2155
Microchip
HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871,
MCP2155
Microchip
location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A,
MMT-261300606.000
Microchip
LOT MMT-261300606.000 MMT-261400257.000 MMT-263800306.000
MMT-261400257.000
Microchip
LOT MMT-261300606.000 MMT-261400257.000 MMT-263800306.000
MMT-263800306.000
Microchip
LOT MMT-261300606.000 MMT-261400257.000 MMT-263800306.000
MR1243
Microchip
System: Vitronics Soltec MR1243
MTAI261301779.000
Microchip
MTAI261301779.000 GRSM425511355.310 2526BPV
MTAI261301915.000
Microchip
MTAI261301915.000 GRSM425511355.310 2526C36
MTAI261301921.000
Microchip
MTAI261301921.000 GRSM425511355.310 2526C3C
PIC16F627
Microchip
fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627,
PIC16F627
Microchip
location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A,
PIC16F627
Microchip
HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871,
PIC16F628
Microchip
location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A,
PIC16F628
Microchip
PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873,
PIC16F628
Microchip
HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871,
PIC16F84A
Microchip
location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A,
PIC16F84A
Microchip
PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873,
PIC16F84A
Microchip
HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871,
PIC16F870
Microchip
PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873,
PIC16F870
Microchip
PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877
PIC16F870
Microchip
HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871,
PIC16F871
Microchip
PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873,
PIC16F871
Microchip
PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877
PIC16F871
Microchip
HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871,
PIC16F872
Microchip
PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873,
PIC16F872
Microchip
PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various
PIC16F872
Microchip
Device PIC16F872
PIC16F872
Microchip
PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877
PIC16F873
Microchip
PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873,
PIC16F873
Microchip
PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various
PIC16F873
Microchip
PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877
PR-3SPH
Microchip
System: TABAI ESPEC Model PR-3SPH
Q006
Microchip
packages. This is a Q006 Grade 1 qualification.
Q006
Microchip
device families available in various packages. This is a Q006 Grade 1 qualification.
Q100-005
Microchip
Test Method AEC Q100-005 | JESD22-A103
Q100-005
Microchip
Test Method AEC Q100-005 | JESD22-A108
Q100-008
Microchip
Test Method AEC Q100-008
QCI-39000.This
Microchip
28L SOIC (.300in) assembled by MTAI pass reliability test per QCI-39000.This
R2500876
Microchip
R2500876 Rev. A
SAS-3000
Microchip
System: SAS-3000
TSA-70H
Microchip
System: TABAI ESPEC TSA-70H
HCS370
Microchip
new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627
| PIC16F874 | Microchip | PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F876 | Microchip | PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F877 | Microchip | PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F874 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F874 | Microchip | PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various |
| PIC16F874 | Microchip | PIC16F874, PIC16F876 and PIC16F877 device families available in various |
| PIC16F876 | Microchip | PIC16F874, PIC16F876 and PIC16F877 device families available in various |
| PIC16F876 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F876 | Microchip | PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various |
| PIC16F877 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F877 | Microchip | PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various |
| PIC16F877 | Microchip | PIC16F874, PIC16F876 and PIC16F877 device families available in various |
| MCP2150 | Microchip | new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627 |
| MCP2155 | Microchip | new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627 |
| PIC16F627 | Microchip | PIC16F627, PIC16F628, PIC16F84A, PIC16F870 |
| PIC16F628 | Microchip | PIC16F627, PIC16F628, PIC16F84A, PIC16F870 |
| PIC16F84A | Microchip | PIC16F627, PIC16F628, PIC16F84A, PIC16F870 |
| PIC16F870 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873 |
| PIC16F871 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873 |
| PIC16F872 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873 |
| PIC16F873 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873 |
| PIC16LF872 | Microchip | Part No. PIC16F872/PIC16LF872 |
| 105mA | Microchip | 12/Lot 1 6 Pass @ +25°C, 105mA Pulse |
| 105mA | Microchip | 6 Pass @ +125°C, 105mA Pulse |
| 12/Lot | Microchip | 12/Lot 1 6 Pass @ +25°C, 105mA Pulse |
| 12/Lot | Microchip | 12/Lot 1 ± 3000V (Passed) |
| 120K | Microchip | for qualification testing. This qualification will release the 120K Flash, device family process to production. |
| 125oC | Microchip | Test Condition 125oC / 1008 hours |
| 125oC | Microchip | Test Condition 125oC / 48 hours |
| 150oC | Microchip | Test Condition 150oC / 1008 hours |
| 18/Lot | Microchip | 18/Lot 1 ± 2000V corner pins (Passed) |
| 2000V | Microchip | 18/Lot 1 ± 2000V corner pins (Passed) |
| 2200D | Microchip | System: ERSA RA 2200D |
| 2526BPV | Microchip | MTAI261301779.000 GRSM425511355.310 2526BPV |
| 2526C36 | Microchip | MTAI261301915.000 GRSM425511355.310 2526C36 |
| 2526C3C | Microchip | MTAI261301921.000 GRSM425511355.310 2526C3C |
| 28L | Microchip | 28L SOIC (.300in) assembled by MTAI pass reliability test per QCI-39000.This |
| 28L | Microchip | 28L SOIC |
| 3000V | Microchip | 12/Lot 1 ± 3000V (Passed) |
| 6000X | Microchip | System: HAST 6000X |
| 95.5Ag3.9 | Microchip | Solder material: Pb Free Sn 95.5Ag3.9 |
| A-066093 | Microchip | A-066093 Rev A -Temp BD |
| AEC-Q100-002 | Microchip | ESD – HBM AEC-Q100-002 |
| AEC-Q100-004 | Microchip | ESD – LU AEC-Q100-004 |
| AEC-Q100-011 | Microchip | ESD – CDM AEC-Q100-011 |
| DSNO-17TVWI575 | Microchip | PCN #: DSNO-17TVWI575 |
| GRSM425511355.300 | Microchip | LOT GRSM425511355.300 GRSM426042763.210 GRSM426202783.100 |
| GRSM425511355.310 | Microchip | MTAI261301779.000 GRSM425511355.310 2526BPV |
| GRSM425511355.310 | Microchip | MTAI261301915.000 GRSM425511355.310 2526C36 |
| GRSM425511355.310 | Microchip | MTAI261301921.000 GRSM425511355.310 2526C3C |
| GRSM426042763.210 | Microchip | LOT GRSM425511355.300 GRSM426042763.210 GRSM426202783.100 |
| GRSM426202783.100 | Microchip | LOT GRSM425511355.300 GRSM426042763.210 GRSM426202783.100 |
| HCS370 | Microchip | fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, |
| HCS370 | Microchip | HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, |
| HCS370 | Microchip | location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, |
| J-STD-020E | Microchip | temperature per IPC/JEDEC J-STD-020E standard. |
| J-STD-020E | Microchip | (IPC/JEDEC J-STD-020E) |
| J750 | Microchip | System: J750 231(0) 0/231 Pass 77 units / lot |
| J750 | Microchip | System: J750 |
| J750 | Microchip | System: J750 231(0) 0/231 Pass |
| J750 | Microchip | System: J750 135(0) 0/135 Pass |
| JESD22-A103 | Microchip | Test Method AEC Q100-005 | JESD22-A103 |
| JESD22-A108 | Microchip | Test Method AEC Q100-005 | JESD22-A108 |
| MCP2150 | Microchip | HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, |
| MCP2150 | Microchip | location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, |
| MCP2150 | Microchip | fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, |
| MCP2155 | Microchip | fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, |
| MCP2155 | Microchip | HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, |
| MCP2155 | Microchip | location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, |
| MMT-261300606.000 | Microchip | LOT MMT-261300606.000 MMT-261400257.000 MMT-263800306.000 |
| MMT-261400257.000 | Microchip | LOT MMT-261300606.000 MMT-261400257.000 MMT-263800306.000 |
| MMT-263800306.000 | Microchip | LOT MMT-261300606.000 MMT-261400257.000 MMT-263800306.000 |
| MR1243 | Microchip | System: Vitronics Soltec MR1243 |
| MTAI261301779.000 | Microchip | MTAI261301779.000 GRSM425511355.310 2526BPV |
| MTAI261301915.000 | Microchip | MTAI261301915.000 GRSM425511355.310 2526C36 |
| MTAI261301921.000 | Microchip | MTAI261301921.000 GRSM425511355.310 2526C3C |
| PIC16F627 | Microchip | fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, |
| PIC16F627 | Microchip | location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, |
| PIC16F627 | Microchip | HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, |
| PIC16F628 | Microchip | location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, |
| PIC16F628 | Microchip | PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, |
| PIC16F628 | Microchip | HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, |
| PIC16F84A | Microchip | location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, |
| PIC16F84A | Microchip | PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, |
| PIC16F84A | Microchip | HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, |
| PIC16F870 | Microchip | PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, |
| PIC16F870 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F870 | Microchip | HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, |
| PIC16F871 | Microchip | PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, |
| PIC16F871 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F871 | Microchip | HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, |
| PIC16F872 | Microchip | PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, |
| PIC16F872 | Microchip | PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various |
| PIC16F872 | Microchip | Device PIC16F872 |
| PIC16F872 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 |
| PIC16F873 | Microchip | PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, |
| PIC16F873 | Microchip | PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various |
| PIC16F873 | Microchip | PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 |
| PR-3SPH | Microchip | System: TABAI ESPEC Model PR-3SPH |
| Q006 | Microchip | packages. This is a Q006 Grade 1 qualification. |
| Q006 | Microchip | device families available in various packages. This is a Q006 Grade 1 qualification. |
| Q100-005 | Microchip | Test Method AEC Q100-005 | JESD22-A103 |
| Q100-005 | Microchip | Test Method AEC Q100-005 | JESD22-A108 |
| Q100-008 | Microchip | Test Method AEC Q100-008 |
| QCI-39000.This | Microchip | 28L SOIC (.300in) assembled by MTAI pass reliability test per QCI-39000.This |
| R2500876 | Microchip | R2500876 Rev. A |
| SAS-3000 | Microchip | System: SAS-3000 |
| TSA-70H | Microchip | System: TABAI ESPEC TSA-70H |
| HCS370 | Microchip | new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627 |