Search Results for &quot; 70V3319S133BCGI &quot;

SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 256-Pin CABGA

Volume Production

Access Time: 4.2ns

Address Bus Width: 36b

Package/Case: LBGA

Density: 4.5Mb

Integrated Device Technology

CABGA-256, Tray

LBGA, BGA256,16X16,40

Transferred

Max Operating Temperature: 85

Number of Terminals: 256

Min Operating Temperature: -40

Terminal Position: BOTTOM

70V3319S133BCI

SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 256-Pin CABGA

Volume Production

Access Time: 4.2ns

Address Bus Width: 18b

Package/Case: LBGA

Density: 4.5Mb

Search Results for "70V3319S133BCGI"

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SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 256-Pin CABGA

Volume Production

Access Time: 4.2ns

Address Bus Width: 36b

Package/Case: LBGA

Density: 4.5Mb

Integrated Device Technology

CABGA-256, Tray

LBGA, BGA256,16X16,40

Transferred

Max Operating Temperature: 85

Number of Terminals: 256

Min Operating Temperature: -40

Terminal Position: BOTTOM

70V3319S133BCI

SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 256-Pin CABGA

Volume Production

Access Time: 4.2ns

Address Bus Width: 18b

Package/Case: LBGA

Density: 4.5Mb